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5962-0923301VPA

Texas Instruments

5962-0923301VPA by Texas Instruments

5962-0923301VPA by Texas Instruments is a MIL-STD-883 Class V rated ANALOG CIRCUIT IC with 8 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 2.4V to 24V and can withstand up to 30k Rad(Si) total dose. This RECTANGULAR package is ideal for military applications requiring high reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,274 parts In-Stock

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Digiode

USA . 910 parts In-Stock

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910

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Distributors (Availability)

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Ampacity Inc.

Singapore . 754 parts In-Stock

1+ parts

$0.500

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-

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754

$0.500

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Semicontronic

India . 998 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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998

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 301 parts In-Stock

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$6.500

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301

$6.500

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AZTECH Wire

Italy . 622 parts In-Stock

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$16.410

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622

$16.410

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Parana Technologies

USA . 1,343 parts In-Stock

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$16.727

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$16.979

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1,343

$16.727

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$16.979

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DigiPath Technology Company

USA . 140 parts In-Stock

1+ parts

$18.418

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$16.945

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140

$18.418

$16.945

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IDEA Electronic Components Group

UK . 1,464 parts In-Stock

1+ parts

$18.794

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$17.854

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$16.915

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1,464

$18.794

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$16.915

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ChromeModa Solutions

Germany . 278 parts In-Stock

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$18.794

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$15.411

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278

$18.794

$15.411

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Native Components

USA . 941 parts In-Stock

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$44.240

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$42.470

941

$44.240

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$42.470

Northwest PG Solutions

USA . 2,261 parts In-Stock

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$48.664

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2,261

$48.664

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Corphita

USA . 3,478 parts In-Stock

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Microchip USA

USA . 1,329 parts In-Stock

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Component Stockers USA

USA . 337 parts In-Stock

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337

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Corohmni

South Africa . 321 parts In-Stock

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321

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 5962-0923301VPA. As a leader in the semiconductor industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This product is ideal for a wide range of applications in the military sector, ensuring optimal performance in even the most demanding environments. Trust in the value and benefits that Texas Instruments provides, and elevate your projects to new heights with the 5962-0923301VPA.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination ensures durability and reliability for the product, making it suitable for harsh operating conditions.

Screening Level: MIL-STD-883 Class V

The high screening level indicates that the product meets stringent military standards for quality and performance, ensuring robustness in challenging environments.

Nominal Supply Voltage (Vsup): 15 V

The 15 V supply voltage is suitable for a wide range of applications, providing flexibility and compatibility with various systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand elevated temperatures without compromising performance.

Technology: BIPOLAR

The bipolar technology used in this product offers high-speed functionality and precise analog performance, making it a reliable choice for analog circuit applications.

Technical Specifications

Other Function Semiconductors 5962-0923301VPA attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-CDIP-T8

JESD-609 Code:

e0

Length:

9.58 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

15

Qualification:

Qualified

Screening Level:

MIL-STD-883 Class V

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.8 mA

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Total Dose (V):

30k Rad(Si)

Width (mm):

7.62 mm

Trade Compliance

5962-0923301VPA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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