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5962-90650022X

Texas Instruments

5962-90650022X by Texas Instruments

The Texas Instruments 5962-90650022X is a military-grade analog circuit IC in a square chip carrier package. With a nominal voltage of 6V, it operates b/w -55°C to 125°C. This metal-sealed co-fired ceramic package has 20 terminals and is surface mountable, making it suitable for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,399 parts In-Stock

1+ parts

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3,399

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Digiode

USA . 2,260 parts In-Stock

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2,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,295 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,295

$1.500

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Parana Technologies

USA . 1,240 parts In-Stock

1+ parts

$2.920

100+ parts

-

1k+ parts

$3.419

10k+ parts

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1,240

$2.920

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$3.419

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DigiPath Technology Company

USA . 1,586 parts In-Stock

1+ parts

$3.215

100+ parts

$2.958

1k+ parts

-

10k+ parts

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1,586

$3.215

$2.958

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ChromeModa Solutions

Germany . 2,744 parts In-Stock

1+ parts

$3.281

100+ parts

$2.690

1k+ parts

-

10k+ parts

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2,744

$3.281

$2.690

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IDEA Electronic Components Group

UK . 944 parts In-Stock

1+ parts

$3.281

100+ parts

-

1k+ parts

$2.953

10k+ parts

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944

$3.281

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$2.953

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Semicontronic

India . 1,527 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,527

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 794 parts In-Stock

1+ parts

$6.500

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794

$6.500

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AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$7.642

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479

$7.642

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Native Components

USA . 816 parts In-Stock

1+ parts

$10.306

100+ parts

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816

$10.306

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Northwest PG Solutions

USA . 2,092 parts In-Stock

1+ parts

$11.336

100+ parts

$10.203

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2,092

$11.336

$10.203

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Corphita

USA . 4,226 parts In-Stock

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4,226

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Corohmni

South Africa . 451 parts In-Stock

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451

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Overview

Elevate your projects with the 5962-90650022X by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers top-notch quality and reliability with this analog circuit chip carrier. This military-grade component is designed for demanding applications, offering superior performance in extreme temperatures. Experience the benefits of this square-shaped, surface-mount device with 20 terminals, providing a nominal supply voltage of 6V. Trust Texas Instruments to provide you with the tools you need to excel in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and resistance to high temperatures, ensuring the product's reliability in demanding environments.

Surface Mount: YES

Being surface mount compatible makes this product easier to incorporate into modern circuit designs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration with other components in the design.

Nominal Supply Voltage (Vsup): 6 V

The nominal supply voltage of 6V makes this product suitable for applications requiring a stable power source within this range.

No. of Terminals: 20

Having 20 terminals offers flexibility in connectivity and allows for multiple input and output options in the circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and easy handling of the semiconductor, ensuring reliability and ease of installation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product is suitable for high-temperature environments, making it ideal for industrial and military applications.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C allows this product to function reliably even in extremely cold conditions, expanding its potential use cases.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good conductivity and solderability, ensuring secure connections and efficient performance of the product.

Terminal Position: QUAD

The quad terminal position offers a balanced distribution of terminals, simplifying the connection and layout of the product in the circuit design.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this product is designed for processing continuous signals, making it suitable for various applications in signal processing and control systems.

Temperature Grade: MILITARY

The military-grade temperature grade ensures that this product can withstand harsh environmental conditions and operate reliably in challenging military applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the use of lead components, contributing to environmental sustainability and reducing potential health hazards during manufacturing and disposal.

Technical Specifications

Other Function Semiconductors 5962-90650022X attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Qualified

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

5962-90650022X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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