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54F181FM

Texas Instruments

54F181FM by Texas Instruments

The Texas Instruments 54F181FM is a 4-bit digital arithmetic circuit with a propagation delay of 17ns. It operates in temperatures ranging from -55 to 125°C, making it suitable for military-grade applications. With a supply voltage range of 4.5V to 5.5V, this TTL technology-based circuit comes in a rectangular flatpack package ideal for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,993 parts In-Stock

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Digiode

USA . 4,692 parts In-Stock

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Anansix

USA . 1,080 parts In-Stock

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Native Components

USA . 965 parts In-Stock

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$0.831

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$0.831

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Northwest PG Solutions

USA . 1,443 parts In-Stock

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$0.914

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$0.914

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AZTECH Wire

Italy . 310 parts In-Stock

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$13.631

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310

$13.631

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Parana Technologies

USA . 2,005 parts In-Stock

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$16.207

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$1,505.056

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$14.586

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2,005

$16.207

$1,505.056

$14.586

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DigiPath Technology Company

USA . 52 parts In-Stock

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$17.846

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$17.846

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ChromeModa Solutions

Germany . 3,182 parts In-Stock

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$18.210

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$14.932

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3,182

$18.210

$14.932

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IDEA Electronic Components Group

UK . 948 parts In-Stock

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$18.210

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$17.300

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$16.389

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948

$18.210

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One Stop Electronics

USA . 603 parts In-Stock

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$19.000

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Corphita

USA . 2,843 parts In-Stock

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Supply Digital

USA . 2,360 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the Texas Instruments 54F181FM. Crafted with precision using high-quality ceramic and glass-sealed materials, this versatile component offers seamless integration into various applications. From military-grade technology to a wide operating temperature range, this flatpack style circuit guarantees reliability and performance. Trust Texas Instruments to deliver innovative solutions that elevate your projects to new heights. Experience the value of quality craftsmanship with the 54F181FM.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the circuit, ensuring reliable performance even in harsh environments.

No. of Bits: 4

Offers sufficient precision and accuracy for various digital arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supplies, making it easy to integrate into existing systems.

Propagation Delay (tpd): 17 ns

Fast propagation delay ensures quick response times for arithmetic operations.

Temperature Grade: MILITARY

Designed to withstand extreme temperature conditions, suitable for military applications.

Technology: TTL

Utilizes TTL technology which is known for its reliability and simplicity.

Technical Specifications

Digital Arithmetic Circuits 54F181FM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WD_MAX

Family:

F/FAST

JESD-30 Code:

R-GDFP-F24

Length:

15.4305 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

17 ns

Maximum Seated Height:

2.286 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.668 mm

Trade Compliance

54F181FM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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