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54F181SDM

Texas Instruments

54F181SDM by Texas Instruments

54F181SDM by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 17ns. It operates within a temperature range of -55 to 125°C and has a supply voltage range of 4.5V to 5.5V. This MILITARY-grade TTL technology component is commonly used in applications requiring fast arithmetic calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,403 parts In-Stock

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Digiode

USA . 4,546 parts In-Stock

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Anansix

USA . 147 parts In-Stock

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Andel Nordic

Denmark . 452 parts In-Stock

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$0.530

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$0.368

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$0.368

452

$0.530

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$0.368

Northwest PG Solutions

USA . 467 parts In-Stock

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$3.564

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AZTECH Wire

Italy . 754 parts In-Stock

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$6.589

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Parana Technologies

USA . 1,338 parts In-Stock

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$24.180

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$24.841

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DigiPath Technology Company

USA . 2,193 parts In-Stock

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$26.625

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$24.495

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ChromeModa Solutions

Germany . 4,454 parts In-Stock

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$27.168

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$22.278

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IDEA Electronic Components Group

UK . 2,307 parts In-Stock

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$27.168

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$25.810

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$24.451

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One Stop Electronics

USA . 1,134 parts In-Stock

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$49.000

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Corphita

USA . 4,917 parts In-Stock

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Supply Digital

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Native Components

USA . 407 parts In-Stock

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$3.143

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Overview

Enhance your digital arithmetic circuits with the high-quality 54F181SDM by Texas Instruments. This rectangular ceramic, glass-sealed package offers 4 bits of precision and a fast propagation delay of 17ns, making it ideal for military-grade applications where speed and accuracy are essential. With a nominal supply voltage of 5V and a wide operating temperature range from -55°C to 125°C, this versatile component guarantees reliable performance in any environment. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and efficiency to meet all your circuit design needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Bits: 4

Having a 4-bit design allows for a compact size and efficient operation, making it suitable for applications that require moderate precision.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures stable and consistent performance, making it compatible with a wide range of systems and power sources.

Propagation Delay (tpd): 17 ns

The low propagation delay of 17 ns ensures fast signal processing and response times, making it ideal for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable performance in harsh environments or under heavy usage.

Technology: TTL

TTL technology offers high-speed operation and reliable logic levels, making it suitable for demanding digital arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits 54F181SDM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T24

Length:

32.77 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

17 ns

Maximum Seated Height:

5.715 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F181SDM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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