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54F182LM

Texas Instruments

54F182LM by Texas Instruments

54F182LM by Texas Instruments is a digital arithmetic circuit with 4 bits, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 12ns and can withstand temperatures from -55°C to 125°C. This chip carrier package is ideal for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,510 parts In-Stock

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Digiode

USA . 4,909 parts In-Stock

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Anansix

USA . 1,176 parts In-Stock

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Native Components

USA . 205 parts In-Stock

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$1.043

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$1.043

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Northwest PG Solutions

USA . 1,657 parts In-Stock

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$1.147

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$1.147

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AZTECH Wire

Italy . 485 parts In-Stock

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$18.460

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$18.460

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Parana Technologies

USA . 1,764 parts In-Stock

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$19.087

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$19.137

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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$21.017

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$19.336

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ChromeModa Solutions

Germany . 4,326 parts In-Stock

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$21.446

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$17.586

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IDEA Electronic Components Group

UK . 1,829 parts In-Stock

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$21.446

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$20.374

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$19.301

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Andel Nordic

Denmark . 50 parts In-Stock

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$31.120

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$21.787

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$21.787

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One Stop Electronics

USA . 1,159 parts In-Stock

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$41.000

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Corphita

USA . 4,587 parts In-Stock

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Supply Digital

USA . 1,345 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments 54F182LM digital arithmetic circuit. Crafted by a renowned manufacturer, this innovative product offers unparalleled quality and precision. Ideal for various applications, this chip carrier package boasts a fast propagation delay of 12ns, ensuring efficient operation. With a wide temperature range and military-grade durability, customers can trust in the exceptional value and benefits that this cutting-edge technology provides. Elevate your projects with the 54F182LM and discover the advantages of choosing Texas Instruments for all your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in harsh operating environments.

No. of Bits: 4

This digital arithmetic circuit is designed for applications that require processing data in 4-bit binary format, making it suitable for a wide range of digital computing tasks.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures stable and efficient operation of the circuit, making it compatible with standard power sources.

Propagation Delay (tpd): 12 ns

With a propagation delay of 12 nanoseconds, this circuit can process data quickly and efficiently, making it ideal for applications that require fast response times.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this circuit can withstand extreme temperature ranges and harsh conditions while maintaining reliable performance.

Technical Specifications

Digital Arithmetic Circuits 54F182LM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

54F182LM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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