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54F182FM

Texas Instruments

54F182FM by Texas Instruments

The Texas Instruments 54F182FM is a 4-bit digital arithmetic circuit with a propagation delay of 12ns. Operating at a supply voltage range of 4.5V to 5.5V, it is designed for military-grade applications requiring fast calculations in a compact flatpack package style. With surface mount capability and dual terminal position, this TTL technology chip offers reliable performance in harsh environments from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,381 parts In-Stock

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Digiode

USA . 1,764 parts In-Stock

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Anansix

USA . 167 parts In-Stock

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167

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Native Components

USA . 308 parts In-Stock

1+ parts

$0.617

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308

$0.617

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Northwest PG Solutions

USA . 1 parts In-Stock

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$0.679

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1

$0.679

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One Stop Electronics

USA . 1,232 parts In-Stock

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$4.000

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$4.000

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Parana Technologies

USA . 2,207 parts In-Stock

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$13.272

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$13.776

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$13.272

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$13.776

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DigiPath Technology Company

USA . 54 parts In-Stock

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$14.614

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54

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ChromeModa Solutions

Germany . 3,158 parts In-Stock

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$14.912

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$12.228

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$14.912

$12.228

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IDEA Electronic Components Group

UK . 626 parts In-Stock

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$14.912

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$14.166

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$13.421

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626

$14.912

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$13.421

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AZTECH Wire

Italy . 805 parts In-Stock

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$18.233

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805

$18.233

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Andel Nordic

Denmark . 1,000 parts In-Stock

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$24.400

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$17.077

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$17.077

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$24.400

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$17.077

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Corphita

USA . 3,953 parts In-Stock

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Supply Digital

USA . 417 parts In-Stock

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Overview

Elevate your digital arithmetic circuit designs with the high-quality 54F182FM by Texas Instruments. Known for their exceptional manufacturing standards, Texas Instruments delivers reliable components that exceed industry expectations. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and performance. Embrace the benefits of seamless integration, fast propagation delay, and military-grade temperature resilience. Upgrade your projects with the 54F182FM and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed materials provide durability and protection to the circuit, ensuring reliable performance in various conditions.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and enabling efficient assembly processes.

No. of Bits: 4

With 4 bits, this circuit can handle a moderate level of digital arithmetic operations, suitable for many applications.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage, this circuit is compatible with many existing systems and power sources.

Propagation Delay: 12 ns

The low propagation delay of 12 ns ensures fast calculations and response times, making it ideal for real-time processing tasks.

Temperature Grade: MILITARY

Designed to meet military-grade temperature requirements, this circuit can withstand extreme temperatures and harsh environments.

Technology: TTL

Using TTL technology ensures compatibility with TTL logic levels and enhances noise immunity in digital signal processing.

Technical Specifications

Digital Arithmetic Circuits 54F182FM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

54F182FM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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