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VND830PEP-E

STMicroelectronics

VND830PEP-E by STMicroelectronics

VND830PEP-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features a compact 24-terminal design, ideal for automotive applications. This device supports output currents up to 9A, ensuring reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,518

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-

-

-

Digiode

USA . 2,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,460

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-

-

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Anansix

USA . 1,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,960

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,441 parts In-Stock

1+ parts

$12.746

100+ parts

-

1k+ parts

$11.471

10k+ parts

-

1,441

$12.746

-

$11.471

-

AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$21.710

100+ parts

-

1k+ parts

-

10k+ parts

-

800

$21.710

-

-

-

MKK Technologies

India . 2,048 parts In-Stock

1+ parts

$23.967

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

$23.967

-

-

-

DigiPath Technology Company

USA . 2,048 parts In-Stock

1+ parts

$23.967

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

$23.967

-

-

-

Ampacity Inc.

Singapore . 130 parts In-Stock

1+ parts

$43.500

100+ parts

-

1k+ parts

-

10k+ parts

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130

$43.500

-

-

-

Component Stockers USA

USA . 414 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$99.990

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 14,141 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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14,141

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-

-

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A-Z Elektronik GmbH

Germany . 6,536 parts In-Stock

1+ parts

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6,536

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Microchip USA

USA . 4,282 parts In-Stock

1+ parts

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100+ parts

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4,282

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Corphita

USA . 3,445 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,445

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-

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Parana Technologies

USA . 1,972 parts In-Stock

1+ parts

-

100+ parts

$15.239

1k+ parts

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10k+ parts

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1,972

-

$15.239

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,000

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Overview

Unlock innovation with the VND830PEP-E from STMicroelectronics, a cutting-edge peripheral driver designed for performance and reliability. With robust built-in protections and a compact design, this versatile component is perfect for various applications, ensuring your devices operate seamlessly. Trust in STMicroelectronics' legacy of quality to enhance your projects, reduce downtime, and maximize efficiency—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, contributing to the longevity of the product.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, making integration easier in modern applications.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can handle a wide range of applications, making it versatile for various designs.

No. of Functions: 2

This multi-functional capability allows designers to implement more features within limited space, enhancing circuit efficiency.

Package Shape: RECTANGULAR

The rectangular shape is standard and helps simplify layout design on PCBs, ensuring efficient routing of traces.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure reliability and safety in operation, minimizing the risk of damage in dynamic electrical environments.

Power Supplies (V): 8/36

Supporting a broad voltage range makes this peripheral driver suitable for various applications, accommodating different power requirements.

No. of Terminals: 24

With 24 terminals, the device can support complex functionalities and multiple connections without compromising simplicity.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This packaging allows for effective heat dissipation and is suitable for high-density applications, ideal for modern electronic designs.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage means this driver can be powered by common voltage supplies, making it accessible for different applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and improves the reliability of connections, crucial for high-performance applications.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in layout design and aids in easier PCB connectivity.

Maximum Seated Height: 2.47 mm

A low seated height ensures compatibility with thin-profile designs, enhancing form factor options for various applications.

Width: 7.5 mm

The compact width helps save space on PCBs, making it an ideal choice for designs with size constraints.

Length: 10.3 mm

A modest length supports high-density packaging, facilitating integration into tight layouts without sacrificing functionality.

Terminal Form: GULL WING

Gull wing terminals improve mechanical stability and reliability of solder joints, which is critical in field applications.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V allows for optimal operation within specified parameters, ensuring efficient performance.

Terminal Pitch: 0.8 mm

A smaller terminal pitch facilitates increased packing density, allowing more components to fit into a smaller area on the PCB.

Driver No. of Bits: 2

The 2-bit driver configuration enables versatile signal handling capabilities, useful for applications requiring varying levels of control.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates appropriate handling precautions, ensuring the component's reliability in humid environments.

Nominal Output Peak Current Limit: 9 A

A high current limit supports demanding applications and enables the driver to manage power-hungry devices effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being designed for buffer/inverter functionality increases the versatility of this peripheral driver for various signal processing tasks.

Output Current Flow Direction: SOURCE

The source current flow direction is ideal for driving loads, making it suitable for active circuit applications.

Technical Specifications

Peripheral Drivers VND830PEP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND830PEP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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