Loading...

VND830MSPTR-E

STMicroelectronics

VND830MSPTR-E by STMicroelectronics

VND830MSPTR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It operates in extreme temps from -40 °C to 150 °C, making it ideal for automotive applications. With dual functions and a compact design, it efficiently manages high output currents up to 9A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,376

-

-

-

-

Anansix

USA . 2,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,894

-

-

-

-

Chip Stock

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

725

-

-

-

-

Digiode

USA . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

650

-

-

-

-

ComSIT Distribution GmbH

Germany . 182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

182

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,083 parts In-Stock

1+ parts

$8.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

$8.080

-

-

-

IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$8.675

100+ parts

-

1k+ parts

$7.807

10k+ parts

-

68

$8.675

-

$7.807

-

MKK Technologies

India . 1,378 parts In-Stock

1+ parts

$16.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,378

$16.312

-

-

-

DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

$16.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,378

$16.312

-

-

-

Microchip USA

USA . 2,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,583

-

-

-

-

Corphita

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,200

-

-

-

-

Parana Technologies

USA . 1,132 parts In-Stock

1+ parts

-

100+ parts

$10.372

1k+ parts

-

10k+ parts

-

1,132

-

$10.372

-

-

RC Electronics

USA . 1,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,035

-

-

-

-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Overview

Unlock exceptional performance with the VND830MSPTR-E from STMicroelectronics, a leader in innovation and quality. This robust peripheral driver excels in demanding automotive applications, offering unmatched reliability with built-in protections against transient events, overcurrent, and thermal stress. Designed for efficiency and durability, it guarantees superior functionality while ensuring your systems run smoothly under extreme conditions. Elevate your projects with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating space-saving in circuit boards.

Maximum Supply Voltage: 36 V

A high maximum supply voltage expands the range of applications, allowing it to work with various voltage levels.

No. of Functions: 2

Having two functions enhances versatility, enabling the chip to handle multiple tasks efficiently.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for improving layout efficiency on printed circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance user safety and device reliability, significantly reducing the risk of damage.

Power Supplies (V): 13

A nominal supply voltage of 13V makes it suitable for automotive and industrial applications.

No. of Terminals: 10

Ten terminals ensure easy connectivity and support for more complex circuitry.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with a heat sink enables efficient thermal management while maintaining a compact footprint.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 150 °C

High operational temperature limits make this product suitable for harsh environments, ensuring reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures enhances its usability in cold climates or refrigeration applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability, ensuring strong and reliable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easy integration into various circuit configurations.

Maximum Seated Height: 3.65 mm

A low seated height allows for compact designs, making it suitable for high-density applications.

Width: 7.5 mm

A compact width enables tighter component spacing on PCBs, optimizing overall design.

Maximum Time At Peak Reflow Temperature (s): 30

A controlled reflow time contributes to the reliability of soldered connections, reducing the risk of thermal stress.

Peak Reflow Temperature °C: 250

A high peak reflow temperature ensures compatibility with modern soldering techniques.

Length: 9.4 mm

Compact length facilitates ease of placement in tight spaces on a PCB.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this product meets stringent standards for reliability in vehicle applications.

Terminal Form: GULL WING

Gull wing terminals offer enhanced mechanical stability and ease of automated assembly.

Nominal Supply Voltage: 13 V

Optimized for a nominal supply voltage of 13V, ideal for automotive and industrial applications.

Turn-on Time: 60 us

A fast turn-on time ensures quick response for time-sensitive applications.

Terminal Pitch: 1.27 mm

A narrow terminal pitch is optimal for high-density PCB designs, maximizing layout efficiency.

Driver No. of Bits: 2

Two bits of driving capability allow for flexible control over various applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making it suitable for standard assembly processes.

Nominal Output Peak Current Limit: 9 A

A relatively high output peak current limit allows for driving larger loads, making it suitable for heavy-duty applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This specific IC type provides versatility in circuit design, accommodating various peripheral applications.

Turn-off Time: 70 us

A quick turn-off time ensures efficient switching, reducing the impact on power consumption.

Output Current Flow Direction: SOURCE

The ability to source current simplifies integration into a variety of circuit configurations.

Technical Specifications

Peripheral Drivers VND830MSPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

70 us

Turn-on Time:

60 us

Width:

7.5 mm

Trade Compliance

VND830MSPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20