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VND830LSP-E

STMicroelectronics

VND830LSP-E by STMicroelectronics

VND830LSP-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and an output current capacity of 18A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,016 parts In-Stock

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3,016

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Digiode

USA . 1,101 parts In-Stock

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1,101

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Anansix

USA . 99 parts In-Stock

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99

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,672 parts In-Stock

1+ parts

$3.025

100+ parts

-

1k+ parts

$2.722

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1,672

$3.025

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$2.722

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MKK Technologies

India . 1,364 parts In-Stock

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$5.688

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1,364

$5.688

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DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

$5.688

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1,364

$5.688

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AZTECH Wire

Italy . 1,064 parts In-Stock

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$18.470

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1,064

$18.470

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Microchip USA

USA . 134 parts In-Stock

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$91.844

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134

$91.844

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Corphita

USA . 3,381 parts In-Stock

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Perfect Parts

USA . 448 parts In-Stock

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448

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Parana Technologies

USA . 299 parts In-Stock

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$3.617

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299

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$3.617

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Assy Fe

Spain . 100 parts In-Stock

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100

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iodParts Technologies Inc.

India . 4 parts In-Stock

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Overview

Unlock the power of innovation with the VND830LSP-E from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for reliability and efficiency, this versatile peripheral driver excels in demanding applications, providing built-in protections against overcurrent, voltage spikes, and thermal stress. Experience peace of mind with a component that enhances performance while streamlining your designs, ensuring seamless integration and robust operation in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability and longevity in various operating environments.

Surface Mount: YES

Facilitates compact design and easy integration with modern circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 36 V

Allows for versatility in applications, accommodating a wide range of operational requirements.

No. of Functions: 2

Versatile functionality supports multiple use cases, enhancing overall performance without needing additional components.

Package Shape: RECTANGULAR

Standard shape simplifies design and layout for PCB assembly, making it easier to work with.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Robust protection features enhance safety and reliability, reducing the likelihood of damage in adverse conditions.

Power Supplies (V): 8/36

Versatile power supply range enables compatibility with various systems, providing flexibility in design.

No. of Terminals: 10

Sufficient terminal count supports complex connectivity and diverse applications while streamlining integration.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact design with heat sink capability ensures efficient heat dissipation, critical for high-performance applications.

Minimum Supply Voltage: 5.5 V

Low voltage requirements enable the driver to function effectively in power-sensitive applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides good solderability and resistance to oxidation, ensuring reliable electrical connections over time.

Terminal Position: DUAL

Facilitates easier routing on PCBs, allowing for a more organized and efficient layout.

Maximum Seated Height: 3.75 mm

Low profile design makes it suitable for space-constrained applications while ensuring compatibility with standard components.

Width: 7.5 mm

Compact width allows for efficient use of board space, beneficial in dense circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Standard reflow temperature timing contributes to reliable solder joints during manufacturing.

Peak Reflow Temperature °C: 250

High thermal tolerance ensures compatibility with lead-free solder processes, aligning with industry standards.

Length: 9.4 mm

Compact length aids in optimal space utilization on PCBs, essential for modern electronic designs.

Maximum Output Current: 18 A

High output current capability is ideal for driving demanding loads, providing power where it is needed most.

Terminal Form: GULL WING

Gull wing terminals ensure stable connections and facilitate automated PCB assembly processes.

Nominal Supply Voltage: 13 V

Optimized for efficient operation at nominal voltage, ensuring consistent performance across applications.

Terminal Pitch: 1.27 mm

Standard pitch spacing enhances compatibility with a wide range of PCB layouts, facilitating easier integration.

Driver No. of Bits: 2

Supports basic digital control systems, allowing for straightforward applications.

Moisture Sensitivity Level (MSL): 3

Suitable for standard processing conditions, minimizing concerns related to moisture during assembly.

Nominal Output Peak Current Limit: 23 A

Provides additional headroom for peak demands in applications, ensuring reliability and robustness.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed specifically for buffer or inverter applications, enhancing compatibility and performance in specific circuits.

Output Current Flow Direction: SOURCE

Simplifies design considerations in certain applications by providing clear directionality of current flow.

Technical Specifications

Peripheral Drivers VND830LSP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

18 A

Nominal Output Peak Current Limit:

23 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830LSP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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