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VND830ASP13TR

STMicroelectronics

VND830ASP13TR by STMicroelectronics

VND830ASP13TR from STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact design with 10 terminals and supports output currents up to 9A. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

$8.551

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 149 parts In-Stock

1+ parts

$4.645

100+ parts

$4.877

1k+ parts

$4.598

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149

$4.645

$4.877

$4.598

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Nova Conductors

Japan . 1,000 parts In-Stock

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$12.458

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1,000

$12.458

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Vyrian

USA . 5,693 parts In-Stock

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5,693

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Digiode

USA . 1,934 parts In-Stock

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1,934

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Anansix

USA . 1,922 parts In-Stock

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1,922

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J2 Sourcing AB

Sweden . 42 parts In-Stock

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42

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Elcom Components

USA . 34 parts In-Stock

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$5.675

100+ parts

-

1k+ parts

$5.108

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-

670

$5.675

-

$5.108

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MKK Technologies

India . 814 parts In-Stock

1+ parts

$10.672

100+ parts

-

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814

$10.672

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DigiPath Technology Company

USA . 814 parts In-Stock

1+ parts

$10.672

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-

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814

$10.672

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AZTECH Wire

Italy . 124 parts In-Stock

1+ parts

$11.570

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124

$11.570

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QUARKTWIN TECHNOLOGY LTD

USA . 8,545 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,389 parts In-Stock

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7,389

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Microchip USA

USA . 6,719 parts In-Stock

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6,719

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Metaverse IC Inc.

Canada . 3,153 parts In-Stock

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Perfect Parts

USA . 2,648 parts In-Stock

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Futuretech Components

Singapore . 2,260 parts In-Stock

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2,260

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Parana Technologies

USA . 2,112 parts In-Stock

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$6.786

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$6.786

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Kepictronics

USA . 1,260 parts In-Stock

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Authorized Procurement Solutions

USA . 425 parts In-Stock

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425

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Corphita

USA . 134 parts In-Stock

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134

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iodParts Technologies Inc.

India . 34 parts In-Stock

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Overview

Elevate your designs with the VND830ASP13TR from STMicroelectronics, a leader in innovation and quality. This robust peripheral driver ensures reliability with built-in protections against transient spikes, overcurrent, and thermal issues, making it perfect for demanding applications. Its compact design and surface-mount capability simplify integration, while the impressive current handling delivers exceptional performance. Choose STMicroelectronics for peace of mind and unparalleled value in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers a lightweight and durable design, ensuring reliability in various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated manufacturing processes.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36 V allows for flexibility in various applications, accommodating higher voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB layouts and can be easily integrated into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These built-in protections enhance device longevity and reliability, safeguarding against common electrical faults.

Power Supplies (V): 13

Operating at a nominal power supply of 13 V ensures compatibility with a wide range of devices and systems.

No. of Terminals: 10

The 10 terminals provide ample connectivity options, facilitating versatile applications and easy integration.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with heat sink/slug enhances thermal management and enables efficient space usage.

Minimum Supply Voltage: 5.5 V

With a minimum supply voltage of 5.5 V, this driver supports low-voltage applications, broadening its usability.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and prevents corrosion, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB design and facilitates easier routing for electrical connections.

Maximum Seated Height: 3.65 mm

A maximum seated height of 3.65 mm ensures compatibility with low-profile designs, making it suitable for compact applications.

Width: 7.5 mm

The 7.5 mm width strikes a balance between size and functionality, allowing for efficient layouts on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds helps in maintaining component integrity during assembly processes.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures compatibility with modern manufacturing processes while preventing damage to the component.

Length: 9.4 mm

At 9.4 mm in length, this product fits well in compact devices and enables efficient use of PCB real estate.

Terminal Form: GULL WING

Gull wing terminals are known for their strong mechanical connection and reliable electrical performance.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V ensures stable operation in a variety of electronic applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density layouts while still being manageable for assembly and soldering.

Driver No. of Bits: 2

Having a 2-bit driver allows for control of multiple channels, making it suitable for versatile driving applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product is suitable for standard soldering processes and can tolerate moderate exposure to moisture.

Nominal Output Peak Current Limit: 9 A

The 9 A output current limit allows this product to handle high power requirements, enhancing its suitability for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver offers versatility in applications such as signal conditioning and logic level shifting.

Output Current Flow Direction: SOURCE

The source current flow direction is ideal for driving loads directly, making it an efficient choice for peripheral applications.

Technical Specifications

Peripheral Drivers VND830ASP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830ASP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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