Loading...

VND810-E

STMicroelectronics

VND810-E by STMicroelectronics

VND810-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and output current up to 5A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,284

-

-

-

-

Digiode

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,485

-

-

-

-

Anansix

USA . 955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

955

-

-

-

-

ComSIT Distribution GmbH

Germany . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

ComSIT USA

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Greenchips

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,983 parts In-Stock

1+ parts

$10.132

100+ parts

-

1k+ parts

$9.119

10k+ parts

-

1,983

$10.132

-

$9.119

-

AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$15.050

100+ parts

-

1k+ parts

-

10k+ parts

-

838

$15.050

-

-

-

MKK Technologies

India . 1,190 parts In-Stock

1+ parts

$19.052

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

$19.052

-

-

-

DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

$19.052

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

$19.052

-

-

-

Ampacity Inc.

Singapore . 988 parts In-Stock

1+ parts

$31.500

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$31.500

-

-

-

Microchip USA

USA . 485 parts In-Stock

1+ parts

$63.115

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$63.115

-

-

-

Parana Technologies

USA . 1,891 parts In-Stock

1+ parts

-

100+ parts

$12.114

1k+ parts

-

10k+ parts

-

1,891

-

$12.114

-

-

Corphita

USA . 964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

964

-

-

-

-

iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock unparalleled performance with the VND810-E from STMicroelectronics—a leader in innovation and quality. This versatile peripheral driver excels in demanding applications, offering robust built-in protections against overcurrent, voltage spikes, and thermal issues. Designed for reliability, it empowers your projects with precise control and efficiency, ensuring seamless integration in automotive, industrial, or consumer electronics. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances the reliability and longevity of the product, making it suitable for various electronic applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern PCB designs, improving manufacturing efficiency and saving space.

Maximum Supply Voltage: 36 V

The high maximum supply voltage increases flexibility in a broad range of applications, accommodating various power requirements.

No. of Functions: 2

Having two functions offers versatility, allowing the device to perform multiple tasks and enhancing its utility in diverse applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates space-efficient layout on PCBs, making it easier to work with in compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections ensure reliable operation under various conditions, safeguarding both the driver and connected components from damage.

Power Supplies (V): 8/36

Support for a range of input voltages (8V to 36V) allows for flexibility in design, making this driver suitable for multiple applications.

No. of Terminals: 16

With 16 terminals, the device offers sufficient connection points for complex circuit designs, promoting extensive functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style is conducive to compact designs, saving space on PCBs without compromising on performance.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage offers compatibility with low-voltage applications, broadening the scope of its use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances conductivity and resistance to corrosion, promoting long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positioning allows for versatile placement options in circuit layouts, enhancing design freedom and adaptability.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a slim profile, which is advantageous for space-critical applications.

Width: 3.9 mm

The narrow width enables efficient use of board space, allowing for a more compact design overall.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum reflow time indicates good thermal resilience during soldering processes, ensuring reliable connections.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates that the component can withstand high-heat soldering processes, enhancing manufacturability.

Length: 9.9 mm

The compact length supports space-efficient design, making it ideal for modern electronics where every millimeter counts.

Maximum Output Current: 3.5 A

A high maximum output current allows the driver to handle substantial loads, making it suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminal form is typically easier to solder and provides strong mechanical support, enhancing the reliability of connections.

Nominal Supply Voltage: 13 V

The nominal supply voltage optimally balances power requirements for typical applications, ensuring efficient operation.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates dense arrangements on the PCB, allowing for greater design flexibility.

Driver No. of Bits: 2

Having two bits allows for a simplified interface, making integration into systems easier and more efficient.

Moisture Sensitivity Level (MSL): 3

Knowing the MSL level helps manufacturers understand handling and storage requirements, ensuring longevity and reliability.

Nominal Output Peak Current Limit: 5 A

A peak current limit of 5 A means this driver can handle high bursts of current, ideal for applications requiring quick surges.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification indicates versatility in handling various peripheral signals, enhancing compatibility with multiple systems.

Output Current Flow Direction: SOURCE

The source flow direction simplifies the design of certain circuits, ensuring compatibility with a wide range of load types.

Technical Specifications

Peripheral Drivers VND810-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3.5 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

VND810-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20