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VND1NV04-E

STMicroelectronics

VND1NV04-E by STMicroelectronics

VND1NV04-E by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a max output peak current of 1.7 A and fast turn-on time of 1 µs. Ideal for buffer/inverter applications in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,053

-

-

-

-

Digiode

USA . 3,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,607

-

-

-

-

ComSIT Distribution GmbH

Germany . 2,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

-

-

-

-

Anansix

USA . 2,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,111

-

-

-

-

Chip Stock

USA . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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165

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$9.139

100+ parts

-

1k+ parts

$8.225

10k+ parts

-

271

$9.139

-

$8.225

-

Ampacity Inc.

Singapore . 331 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$14.500

-

-

-

AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$16.260

100+ parts

-

1k+ parts

-

10k+ parts

-

879

$16.260

-

-

-

MKK Technologies

India . 718 parts In-Stock

1+ parts

$17.186

100+ parts

-

1k+ parts

-

10k+ parts

-

718

$17.186

-

-

-

DigiPath Technology Company

USA . 718 parts In-Stock

1+ parts

$17.186

100+ parts

-

1k+ parts

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10k+ parts

-

718

$17.186

-

-

-

Microchip USA

USA . 1,274 parts In-Stock

1+ parts

$40.468

100+ parts

-

1k+ parts

-

10k+ parts

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1,274

$40.468

-

-

-

Component Stockers USA

USA . 710 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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710

$99.990

-

-

-

Corphita

USA . 2,420 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,420

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-

-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

-

-

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Parana Technologies

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$10.927

1k+ parts

-

10k+ parts

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266

-

$10.927

-

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Overview

Elevate your designs with the VND1NV04-E by STMicroelectronics—a premier peripheral driver that combines reliability and performance. Crafted with precision, this compact solution offers built-in protections against transients, overcurrent, and thermal events, ensuring robust operation in diverse applications. Trust in STMicroelectronics' legacy of innovation and quality to deliver exceptional value, empowering you to create efficient, high-performing systems that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions, making it an excellent choice for peripheral applications.

Surface Mount: YES

Surface mount capability allows for compact and efficient PCB designs, enhancing the integration process in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape provides space-efficient layout options and simplifies the design process for manufacturers.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

These comprehensive built-in protections ensure the safety and reliability of the device, significantly reducing the risk of damage and downtime.

No. of Terminals: 2

With only 2 terminals, this component offers straightforward connectivity, simplifying integration into peripheral circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it suitable for a wide range of devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring robust electrical connections.

Terminal Position: SINGLE

Having a single terminal position simplifies PCB layout and minimizes potential connection errors during assembly.

Maximum Seated Height: 2.63 mm

The low profile of 2.63 mm allows for easy mounting in compact designs, making it a versatile choice for thin devices.

Width: 6.1 mm

The 6.1 mm width allows for easy placement on PCBs, optimizing space without compromising performance.

Length: 6.5 mm

At 6.5 mm in length, this component fits well in various layouts, making it adaptable for different designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, ensuring reliable performance in various conditions.

Turn-on Time: 1 us

The ultra-fast turn-on time of 1 microsecond increases operational efficiency and responsiveness in data transfer applications.

Terminal Pitch: 2.25 mm

A terminal pitch of 2.25 mm allows for compact designs while maintaining sufficient spacing for reliable soldering.

Nominal Output Peak Current Limit: 1.7 A

The peak current limit of 1.7 A makes this device capable of handling demanding tasks without risking overheating or operational failure.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed specifically as a buffer or inverter driver, it ensures effective signal management for peripheral devices, enhancing the overall system performance.

Turn-off Time: 5.5 us

A turn-off time of 5.5 microseconds facilitates efficient operation, allowing the device to quickly adapt to changing signal requirements.

Output Current Flow Direction: SINK

The sink current flow direction is ideal for various applications, enabling easier interfacing with multiple peripherals.

Technical Specifications

Peripheral Drivers VND1NV04-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

6.1 mm

Trade Compliance

VND1NV04-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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