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TSM1013ID

STMicroelectronics

TSM1013ID by STMicroelectronics

TSM1013ID by STMicroelectronics is a versatile power management IC with an 18V nominal voltage, operating b/w 4.5V and 28V. It features an 8-terminal gull-wing design and operates efficiently at temperatures up to 105 °C. Ideal for compact applications, it supports reliable power supply circuits in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,089

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-

-

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Vyrian

USA . 2,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,687

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-

-

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Anansix

USA . 1,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,933

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-

-

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Ashlea Components Ltd

UK . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,555 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

3,555

$0.400

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.749

100+ parts

$1.592

1k+ parts

$1.434

10k+ parts

-

500

$1.749

$1.592

$1.434

-

Microchip USA

USA . 2,586 parts In-Stock

1+ parts

$8.861

100+ parts

-

1k+ parts

-

10k+ parts

-

2,586

$8.861

-

-

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IDEA Electronic Components Group

UK . 1,583 parts In-Stock

1+ parts

$13.883

100+ parts

-

1k+ parts

$12.495

10k+ parts

-

1,583

$13.883

-

$12.495

-

AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$14.770

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$14.770

-

-

-

MKK Technologies

India . 502 parts In-Stock

1+ parts

$26.106

100+ parts

-

1k+ parts

-

10k+ parts

-

502

$26.106

-

-

-

DigiPath Technology Company

USA . 502 parts In-Stock

1+ parts

$26.106

100+ parts

-

1k+ parts

-

10k+ parts

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502

$26.106

-

-

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Kepictronics

USA . 51,965 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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51,965

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Authorized Procurement Solutions

USA . 4,278 parts In-Stock

1+ parts

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4,278

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Corphita

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,788

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-

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Parana Technologies

USA . 1,486 parts In-Stock

1+ parts

-

100+ parts

$16.599

1k+ parts

-

10k+ parts

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1,486

-

$16.599

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Overview

Unlock the potential of your projects with the TSM1013ID from STMicroelectronics—your go-to Power Management IC for reliable performance and efficiency. Renowned for its high-quality manufacturing, STMicroelectronics ensures robust operation across various applications, from consumer electronics to industrial systems. Experience enhanced power management, reduced energy costs, and superior thermal stability, empowering your designs to thrive in demanding environments. Elevate your innovation with the TSM1013ID today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this IC reliable for long-term use.

Surface Mount: YES

Surface mount technology promotes a compact design and simplifies the assembly process, ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and optimized use of board space.

Nominal Supply Voltage (Vsup): 18 V

A nominal supply voltage of 18 V provides a stable operating range for diverse applications.

Power Supplies (V): 18

Designed for 18 V power supplies, this IC is suitable for a wide range of power management tasks.

No. of Terminals: 8

With 8 terminals, it supports various functionalities while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package is optimal for applications where space-saving is essential.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliability even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Operating from 0 °C allows flexibility in various environmental conditions, making it versatile.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and prevents oxidation, contributing to longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates more straightforward connections and optimizes PCB layout.

Maximum Seated Height: 1.75 mm

With a maximum seated height of just 1.75 mm, this IC is perfect for low-profile designs.

Width: 3.9 mm

A width of 3.9 mm allows for efficient space use on the printed circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC offers specialized features tailored for power management.

Minimum Supply Voltage (Vsup): 4.5 V

Accepting a minimum supply voltage of 4.5 V enables compatibility with numerous power systems.

Length: 4.9 mm

Its length of 4.9 mm contributes to its compact footprint, making it suitable for small devices.

Maximum Supply Current (Isup): 1 mA

A maximum supply current of 1 mA ensures low power consumption, which is critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and effective heat dissipation, enhancing reliability.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, it aligns well with common PCB designs and manufacturing processes.

Maximum Supply Voltage (Vsup): 28 V

Capable of handling a maximum supply voltage of 28 V, this IC is suitable for high-voltage applications.

Technical Specifications

Power Management ICs TSM1013ID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM1013ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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