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TS836-4IZ

STMicroelectronics

TS836-4IZ by STMicroelectronics

STMicroelectronics' TS836-4IZ is a Power Management IC with 5V Nominal Voltage, suitable for industrial applications. It features 3 terminals, CMOS technology, and supports +4.4V Nominal Threshold Voltage. With a package style of CYLINDRICAL, it operates b/w -40 to 85 °C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,642 parts In-Stock

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7,642

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Digiode

USA . 1,191 parts In-Stock

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1,191

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Anansix

USA . 728 parts In-Stock

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728

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 381 parts In-Stock

1+ parts

$1.010

100+ parts

-

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381

$1.010

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AZTECH Wire

Italy . 105 parts In-Stock

1+ parts

$18.210

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105

$18.210

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IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$20.832

100+ parts

-

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$18.749

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1,674

$20.832

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$18.749

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MKK Technologies

India . 1,150 parts In-Stock

1+ parts

$39.174

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1,150

$39.174

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DigiPath Technology Company

USA . 1,150 parts In-Stock

1+ parts

$39.174

100+ parts

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1,150

$39.174

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,096 parts In-Stock

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$24.908

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2,096

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$24.908

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Corphita

USA . 1,727 parts In-Stock

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1,727

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Overview

Enhance your power management solutions with the TS836-4IZ by STMicroelectronics. This top-quality Power Management IC offers unrivaled reliability and performance, thanks to its cutting-edge technology and industrial-grade design. Perfect for a wide range of applications, this product provides customers with efficient power support circuits, ensuring seamless operations and optimal energy management. Choose STMicroelectronics for superior quality and value in power management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring long-term reliability and affordability.

Nominal Supply Voltage (Vsup): 5 V

Compatible with commonly used supply voltages, making it versatile for various applications.

No. of Terminals: 3

Simple and easy to use with minimal connections required, contributing to ease of integration.

Maximum Operating Temperature: 85 °C

Capable of operating under high temperatures, suitable for industrial environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high efficiency, making it energy-efficient.

Technical Specifications

Power Management ICs TS836-4IZ attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.50V

Adjustable Threshold:

NO

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+4.4V

Trade Compliance

TS836-4IZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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