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T820T-6I

STMicroelectronics

T820T-6I by STMicroelectronics

T820T-6I by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 8 A, operates from -40 °C to 125 °C, and supports up to 600 V off-state voltage. Ideal for motor control and lighting applications.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,369 parts In-Stock

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5,369

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Digiode

USA . 4,869 parts In-Stock

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4,869

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Anansix

USA . 1,953 parts In-Stock

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1,953

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ACDS - Activité Composants Distribution Service

France . 950 parts In-Stock

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950

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Bristol Electronics

USA . 950 parts In-Stock

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$0.382

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$0.285

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950

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$0.382

$0.285

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Dan-Mar Components

USA . 950 parts In-Stock

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950

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,231 parts In-Stock

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$2.489

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$2.240

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$2.489

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$2.240

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MKK Technologies

India . 478 parts In-Stock

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$4.680

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478

$4.680

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DigiPath Technology Company

USA . 478 parts In-Stock

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$4.680

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478

$4.680

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Microchip USA

USA . 4,623 parts In-Stock

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$6.121

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4,623

$6.121

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AZTECH Wire

Italy . 1,074 parts In-Stock

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$8.770

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Perfect Parts

USA . 8,981 parts In-Stock

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8,981

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Corphita

USA . 2,721 parts In-Stock

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2,721

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Parana Technologies

USA . 1,395 parts In-Stock

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$2.976

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1,395

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$2.976

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Overview

Elevate your AC control projects with the T820T-6I from STMicroelectronics—a trusted leader in semiconductor innovation. This snubberless TRIAC delivers exceptional performance, ensuring reliability in diverse applications, from lighting and motor control to heating systems. With its robust design and proven efficiency, the T820T-6I guarantees minimal leakage and impressive thermal stability, providing you with peace of mind and significant energy savings for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 20 mA

A maximum gate trigger current of 20 mA allows for effective control and reliable operation in circuit designs.

Configuration: SINGLE

Single configuration simplifies design complexity and reduces potential points of failure in the assembly.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on printed circuit boards (PCBs).

Terminal Form: THROUGH-HOLE

Through-hole terminal design ensures strong mechanical connections, enhancing reliability in high-vibration applications.

Maximum Leakage Current: 0.005 mA

Low leakage current minimizes power loss, making it an energy-efficient option for circuit applications.

No. of Terminals: 3

Three terminals provide versatile connection options and ease of integration into various circuit designs.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure and stable installation, reducing the risk of connection issues in use.

Maximum Operating Temperature: 125 °C

The capability to operate at high temperatures (125 °C) makes this triac suited for industrial and high-power applications.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless triac reduces the need for external components, simplifying circuit designs and enhancing reliability.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures makes this triac ideal for harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability of electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies layout design and reduces the complexity of circuit connections.

Maximum RMS On-state Current: 8 A

An on-state current of 8 A supports high-load applications, making it suitable for various control circuits.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage of 1.3 V enables compatibility with a wide range of control circuits, enhancing versatility.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage capability (600 V) allows this triac to handle substantial voltage spikes, ensuring reliability in demanding applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/μs

A high critical rate of rise of off-state voltage (500 V/μs) improves the component's ability to withstand voltage transients, increasing robustness.

Maximum Holding Current: 25 mA

A holding current of 25 mA provides sufficient stability for maintaining operation in various circuit configurations.

Technical Specifications

Triode For Alternating Current (TRIAC) T820T-6I attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

20 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

25 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T820T-6I Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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