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T820-600W

STMicroelectronics

T820-600W by STMicroelectronics

T820-600W by STMicroelectronics is a single TRIAC with 8A RMS on-state current and 600V repetitive peak off-state voltage. Ideal for snubberless applications, it has a max operating temperature of 125 °C. Its package style is flange mount, making it suitable for various AC control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,148 parts In-Stock

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4,148

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Anansix

USA . 1,894 parts In-Stock

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1,894

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Digiode

USA . 1,608 parts In-Stock

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1,608

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,578 parts In-Stock

1+ parts

$2.951

100+ parts

-

1k+ parts

$2.656

10k+ parts

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1,578

$2.951

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$2.656

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MKK Technologies

India . 836 parts In-Stock

1+ parts

$5.550

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836

$5.550

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$5.550

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836

$5.550

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Corphita

USA . 2,449 parts In-Stock

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2,449

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Parana Technologies

USA . 334 parts In-Stock

1+ parts

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$3.529

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334

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$3.529

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Overview

Discover the power and reliability of the T820-600W by STMicroelectronics, a premium TRIAC designed for a wide range of applications. With its high-quality construction and UL recognition, this product offers exceptional performance and durability. Whether you're in need of precise control in lighting systems or motor speed regulation, the T820-600W delivers. Trust STMicroelectronics to provide top-notch solutions that exceed expectations and elevate your projects to new heights. Quality, reliability, and innovation - experience it all with the T820-600W.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for electronic devices.

Maximum DC Gate Trigger Current: 20 mA

High gate trigger current allows for reliable switching of the device, ensuring proper operation.

Configuration: SINGLE

Single configuration simplifies the circuit design and reduces complexity.

Package Shape: RECTANGULAR

Rectangular shape of the package allows for easy mounting and integration into existing setups.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering during assembly.

Maximum Leakage Current: 0.01 mA

Low leakage current helps in improving energy efficiency and reducing power consumption.

No. of Terminals: 3

Having 3 terminals provides flexibility in circuit connections and configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure and stable mounting of the device in applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless TRIAC design helps in reducing electromagnetic interference and improves efficiency.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions as well.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and corrosion resistance.

Terminal Position: SINGLE

Single terminal position simplifies the circuit layout and ensures proper connections.

Maximum RMS On-state Current: 8 A

High maximum RMS on-state current capability allows for handling higher loads without overheating.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage ensures sensitive triggering and reliable operation.

Case Connection: ISOLATED

Isolated case connection enhances safety and reduces the risk of electrical shock in applications.

Repetitive Peak Off-state Voltage: 600 V

High repetitive peak off-state voltage rating ensures reliable operation in high voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 10 V/us

Minimum critical rate of rise of commutation voltage ensures smooth switching and prevents voltage spikes.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/us

Minimum critical rate of rise of off-state voltage enhances the reliability of the device during switching operations.

Maximum Holding Current: 35 mA

High holding current rating ensures the device remains in the on-state and prevents unintentional turn-off.

Reference Standard: UL RECOGNIZED

UL recognized standard ensures compliance with safety regulations and quality standards.

Technical Specifications

Triode For Alternating Current (TRIAC) T820-600W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

20 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T820-600W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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