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Z0103MARLRPG

Onsemi

Z0103MARLRPG by Onsemi

Z0103MARLRPG by Onsemi is a single TRIAC with 1A RMS on-state current, 600V repetitive peak off-state voltage, and 3mA max DC gate trigger current. It is ideal for applications requiring precise AC power control in various electronic devices.

Median Price

$0.198

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,715 parts In-Stock

1+ parts

-

100+ parts

$0.198

1k+ parts

$0.164

10k+ parts

$0.147

1,715

-

$0.198

$0.164

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 557 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$0.155

-

-

-

Vyrian

USA . 3,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,441

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,022 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

$0.147

-

-

-

Corohmni

South Africa . 456 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$0.163

-

-

-

AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$13.850

100+ parts

-

1k+ parts

-

10k+ parts

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392

$13.850

-

-

-

Perfect Parts

USA . 4,887 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,887

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SupplyDigital Components

Austria . 4,684 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,684

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TANS Electronics

Latvia . 3,593 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,593

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Kulean Microsystems

USA . 1,413 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,413

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UHIMA Technologies

Türkiye . 798 parts In-Stock

1+ parts

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100+ parts

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798

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Problanco Electronics

Mexico . 39 parts In-Stock

1+ parts

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100+ parts

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39

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Overview

Unleash the power of innovation with the Z0103MARLRPG by Onsemi, a top-tier manufacturer known for quality and reliability. This TRIAC device is designed to excel in a variety of applications, offering customers unparalleled value and benefits. From efficient energy management to precise motor control, this product ensures optimal performance while maintaining a competitive edge in the market. Elevate your projects with the Z0103MARLRPG and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for various applications.

Maximum DC Gate Trigger Current: 3 mA

The low gate trigger current requirement ensures efficient and reliable operation of the triac.

Configuration: SINGLE

The single configuration simplifies circuit design and installation, making the product user-friendly.

Package Shape: ROUND

The round shape of the package allows for easy mounting and integration into different systems.

Terminal Form: WIRE

The wire terminal form provides a secure and stable connection, ensuring consistent performance.

Maximum Leakage Current: 0.5 mA

The low leakage current enhances the efficiency and safety of the product.

No. of Terminals: 3

The triac with 3 terminals offers flexibility in circuit connections and configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is space-saving and easy to handle during installation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4-quadrant logic level triac provides precise control and switching capability in multiple applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the triac to function effectively in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and connection in various circuit layouts.

Maximum RMS On-state Current: 1 A

The high maximum RMS on-state current rating allows the triac to handle heavy loads with efficiency.

Maximum DC Gate Trigger Voltage: 1.3 V

The low gate trigger voltage requirement makes the triac suitable for low-power control applications.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage capability ensures reliable performance in high-voltage circuits.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

The minimum critical rate of rise of off-state voltage helps in preventing voltage spikes and enhances the safety of the circuit.

Maximum Holding Current: 10 mA

The maximum holding current ensures the triac remains in the on-state even after the gate current is removed.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for reliable soldering during the manufacturing process.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0103MARLRPG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

3 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-W3

JESD-609 Code:

e1

Maximum Leakage Current:

.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

1 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0103MARLRPG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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