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T610-400D

STMicroelectronics

T610-400D by STMicroelectronics

STMicroelectronics' T610-400D is a 4-quadrant logic level TRIAC with max. RMS on-state current of 6A and repetitive peak off-state voltage of 400V. It operates b/w -40 °C to 125°C, ideal for AC power control applications requiring a DC gate trigger current of up to 10mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,843 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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4,843

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Vyrian

USA . 3,250 parts In-Stock

1+ parts

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1k+ parts

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3,250

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Anansix

USA . 242 parts In-Stock

1+ parts

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100+ parts

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242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,470 parts In-Stock

1+ parts

$2.598

100+ parts

-

1k+ parts

$2.338

10k+ parts

-

1,470

$2.598

-

$2.338

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MKK Technologies

India . 749 parts In-Stock

1+ parts

$4.886

100+ parts

-

1k+ parts

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10k+ parts

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749

$4.886

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DigiPath Technology Company

USA . 749 parts In-Stock

1+ parts

$4.886

100+ parts

-

1k+ parts

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10k+ parts

-

749

$4.886

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-

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Corphita

USA . 4,997 parts In-Stock

1+ parts

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4,997

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Parana Technologies

USA . 1,893 parts In-Stock

1+ parts

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100+ parts

$3.106

1k+ parts

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10k+ parts

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1,893

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$3.106

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Overview

Unlock the power of seamless control with the T610-400D by STMicroelectronics. Crafted with precision and expertise, this TRIAC device offers unparalleled quality and reliability for a variety of applications. Whether you're looking to enhance lighting systems, motor speed control, or heating elements, the T610-400D delivers exceptional performance that exceeds expectations. With its innovative design and robust construction, this product ensures optimal functionality and efficiency, making it the ideal choice for your electronic projects. Experience the difference with the T610-400D and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good insulation and protection, making the product reliable and durable.

Maximum DC Gate Trigger Current: 10 mA

With a maximum gate trigger current of 10 mA, this TRIAC is efficient and can be easily controlled.

Configuration: SINGLE

The single configuration simplifies the setup and usage of the TRIAC, making it user-friendly.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections, ensuring stable performance of the TRIAC in different applications.

No. of Terminals: 3

Having 3 terminals provides flexibility in circuit design and connection options, making it versatile for different projects.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers ease of mounting and ensures secure placement of the TRIAC in electronic equipment.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this TRIAC can withstand challenging environmental conditions, increasing its reliability.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 Quadrant Logic Level TRIAC provides precise triggering and control, making it suitable for a wide range of applications requiring accurate switching.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the TRIAC can function effectively in cold environments without any performance issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good conductivity and corrosion resistance, enhancing the performance and longevity of the TRIAC.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and enhances the overall usability of the TRIAC.

Maximum RMS On-state Current: 6 A

With a maximum RMS on-state current of 6 A, this TRIAC can handle moderate power loads efficiently, making it suitable for various applications.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage of 400 V ensures reliable operation and protection against overvoltage conditions, making it a safe choice for electronic circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) T610-400D attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T610-400D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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