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T610-800K

STMicroelectronics

T610-800K by STMicroelectronics

STMicroelectronics T610-800K is a 4-quadrant logic level TRIAC with 800V repetitive peak off-state voltage and 6A max RMS on-state current. It operates b/w -40 °C to 125°C, suitable for AC power control applications in various industries. The device comes in a surface-mount package with Gull Wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,768 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,768

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Anansix

USA . 2,561 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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2,561

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Digiode

USA . 2,064 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,064

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$2.432

100+ parts

-

1k+ parts

$2.188

10k+ parts

-

1,839

$2.432

-

$2.188

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MKK Technologies

India . 1,867 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

-

10k+ parts

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1,867

$4.572

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DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$4.572

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Corphita

USA . 765 parts In-Stock

1+ parts

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765

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Parana Technologies

USA . 33 parts In-Stock

1+ parts

-

100+ parts

$2.907

1k+ parts

-

10k+ parts

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33

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$2.907

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Overview

Upgrade your electronics with the T610-800K by STMicroelectronics, a high-quality Triode For Alternating Current (TRIAC) that offers unparalleled performance and reliability. Manufactured by the reputable STMicroelectronics, this product is designed for a wide range of applications, ensuring optimal functionality and efficiency. With its innovative design and advanced features, the T610-800K provides customers with exceptional value, benefits, and advantages, making it a must-have component for any electronic project. Experience the difference with the T610-800K and elevate your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the TRIAC, making it suitable for a wide range of operating conditions.

Maximum DC Gate Trigger Current: 10 mA

With a maximum DC gate trigger current of 10 mA, this TRIAC can be easily controlled and triggered, allowing for efficient and precise switching operations.

Configuration: SINGLE

The single configuration simplifies installation and makes the TRIAC easy to integrate into various electronic circuits or systems.

Surface Mount: YES

Being surface mountable eliminates the need for additional mounting hardware, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and efficient design for the TRIAC, allowing for easy placement and integration in electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection, ensuring stable operation and reducing the risk of disconnection or malfunction.

No. of Terminals: 3

With three terminals, this TRIAC offers versatility in connectivity options, enabling various circuit configurations and applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enhances the stability and mechanical strength of the TRIAC, making it suitable for demanding industrial environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this TRIAC can withstand elevated heat levels and operate reliably in challenging conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC enables precise control and switching capabilities, making it ideal for a wide range of AC applications and circuits.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in cold environments, making this TRIAC suitable for various temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and reliable electrical connections, ensuring long-term performance and stability of the TRIAC.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of wiring errors, leading to a more efficient and hassle-free integration of the TRIAC.

Maximum RMS On-state Current: 6 A

With a maximum RMS on-state current of 6 A, this TRIAC can handle high current loads efficiently, making it suitable for a wide range of high-power applications.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage of 800 V ensures reliable and robust operation, making this TRIAC suitable for high-voltage applications and environments.

Technical Specifications

Triode For Alternating Current (TRIAC) T610-800K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JESD-30 Code:

R-PSFM-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T610-800K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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