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T610-400K

STMicroelectronics

T610-400K by STMicroelectronics

STMicroelectronics T610-400K is a 4 Quadrant Logic Level TRIAC with max. RMS on-state current of 6A and repetitive peak off-state voltage of 400V. It operates b/w -40 °C to 125°C, suitable for AC power control applications requiring a single configuration TRIAC in surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,808 parts In-Stock

1+ parts

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100+ parts

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3,808

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Digiode

USA . 2,822 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,822

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Anansix

USA . 1,606 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,606

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$2.191

100+ parts

-

1k+ parts

$1.972

10k+ parts

-

755

$2.191

-

$1.972

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MKK Technologies

India . 1,409 parts In-Stock

1+ parts

$4.121

100+ parts

-

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-

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1,409

$4.121

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DigiPath Technology Company

USA . 1,409 parts In-Stock

1+ parts

$4.121

100+ parts

-

1k+ parts

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10k+ parts

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1,409

$4.121

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Corphita

USA . 2,912 parts In-Stock

1+ parts

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2,912

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Parana Technologies

USA . 605 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

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10k+ parts

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605

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$2.620

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Overview

Unleash the power of reliable and high-quality electrical control with the T610-400K by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers superior TRIACs for a wide range of applications. This versatile component offers customers exceptional value, benefits, and advantages, ensuring smooth operation and optimal performance. Upgrade your systems with the T610-400K and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 10 mA

With a maximum DC gate trigger current of 10 mA, this TRIAC can be easily controlled with low power signals, making it suitable for various applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to integrate this TRIAC into different circuits.

Surface Mount: YES

The surface mount capability allows for easy and secure mounting onto circuit boards, making it suitable for compact and space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor, making it compatible with existing designs and easy to handle during assembly.

Terminal Form: GULL WING

The gull wing terminal form offers reliable connections and makes it easier to solder the TRIAC onto circuit boards, ensuring a secure and stable connection.

No. of Terminals: 3

With 3 terminals, this TRIAC provides the necessary connections for gate, MT1, and MT2, facilitating easy integration into various circuit layouts.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers a secure mounting option, allowing for stable installation and preventing movement or disconnection during operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this TRIAC can withstand higher temperatures, ensuring reliable performance in demanding environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC allows for bidirectional current control and can be triggered by logic level signals, making it versatile and suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this TRIAC can operate in cold environments without compromising performance, making it suitable for a variety of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and facilitates soldering, ensuring a reliable and long-lasting connection for the TRIAC.

Terminal Position: SINGLE

The single terminal position simplifies the installation and connection process, ensuring proper alignment and reducing the risk of errors during integration.

Maximum RMS On-state Current: 6 A

With a maximum RMS on-state current of 6 A, this TRIAC can handle higher current loads, making it suitable for applications that require robust and reliable current control.

Repetitive Peak Off-state Voltage: 400 V

The repetitive peak off-state voltage of 400 V ensures reliable isolation and protection against voltage spikes, making this TRIAC suitable for a wide range of AC power control applications.

Technical Specifications

Triode For Alternating Current (TRIAC) T610-400K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JESD-30 Code:

R-PSFM-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T610-400K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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