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T610-400T

STMicroelectronics

T610-400T by STMicroelectronics

STMicroelectronics' T610-400T is a 4 Quadrant Logic Level TRIAC with 6A RMS On-state Current and 400V Repetitive Peak Off-state Voltage. It operates b/w -40 °C to 125°C, ideal for AC power control applications requiring a max DC Gate Trigger Current of 10mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,855

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-

-

-

Vyrian

USA . 457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

457

-

-

-

-

Digiode

USA . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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310

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,225 parts In-Stock

1+ parts

$4.404

100+ parts

-

1k+ parts

$3.964

10k+ parts

-

1,225

$4.404

-

$3.964

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MKK Technologies

India . 1,447 parts In-Stock

1+ parts

$8.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

$8.282

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-

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DigiPath Technology Company

USA . 1,447 parts In-Stock

1+ parts

$8.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

$8.282

-

-

-

Corphita

USA . 1,774 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,774

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-

-

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Parana Technologies

USA . 258 parts In-Stock

1+ parts

-

100+ parts

$5.266

1k+ parts

-

10k+ parts

-

258

-

$5.266

-

-

Overview

Enhance your electrical projects with the T610-400T by STMicroelectronics, a high-quality TRIAC designed to meet your demanding needs. Manufactured by industry leader STMicroelectronics, this TRIAC offers unparalleled reliability and performance, making it perfect for a wide range of applications. Whether you're working on lighting controls, motor speed control, or heating equipment, the T610-400T provides exceptional value, benefits, and advantages that will take your projects to the next level. Upgrade to the T610-400T today and experience the difference in quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the TRIAC, ensuring reliable performance over time.

Maximum DC Gate Trigger Current: 10 mA

The low gate trigger current requirement allows for efficient and precise control of the switching function of the TRIAC, making it suitable for a wide range of applications.

Configuration: SINGLE

The single configuration simplifies the installation and integration of the TRIAC into various circuit designs, reducing complexity and potential points of failure.

Package Shape: RECTANGULAR

The rectangular package shape offers a convenient form factor for mounting and placement in circuit boards or other electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and stable connections with other components, enhancing the overall reliability of the TRIAC in operation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides easy and secure mounting options, ensuring proper positioning and alignment of the TRIAC within a circuit or system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows the TRIAC to function effectively in various environments and conditions without risk of overheating or damage.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC provides precise and reliable triggering for both positive and negative AC cycles, enabling accurate control and switching capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature threshold allows the TRIAC to operate effectively in cold or harsh environmental conditions without compromising performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent conductivity and solderability, ensuring secure and durable connections with other components for reliable operation.

Terminal Position: SINGLE

The single terminal position simplifies the wiring and connection process, reducing the risk of errors or complications during installation and setup.

Maximum RMS On-state Current: 6 A

The maximum RMS on-state current rating of 6 A allows the TRIAC to handle moderate to high electrical loads with efficiency and stability, making it suitable for a variety of applications.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating of 400 V ensures reliable isolation and protection against voltage spikes and surges, enhancing the safety and longevity of the TRIAC.

Technical Specifications

Triode For Alternating Current (TRIAC) T610-400T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

10 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T610-400T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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