Loading...

T2035H-600IRG

STMicroelectronics

T2035H-600IRG by STMicroelectronics

T2035H-600IRG by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 20 A, operates at up to 150 °C, and supports a repetitive peak off-state voltage of 600 V. Ideal for power switching applications in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,189

-

-

-

-

Digiode

USA . 3,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,364

-

-

-

-

Anansix

USA . 1,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,339

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,153 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

$3.305

10k+ parts

-

2,153

$3.672

-

$3.305

-

MKK Technologies

India . 1,395 parts In-Stock

1+ parts

$6.904

100+ parts

-

1k+ parts

-

10k+ parts

-

1,395

$6.904

-

-

-

DigiPath Technology Company

USA . 1,395 parts In-Stock

1+ parts

$6.904

100+ parts

-

1k+ parts

-

10k+ parts

-

1,395

$6.904

-

-

-

AZTECH Wire

Italy . 37 parts In-Stock

1+ parts

$21.830

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$21.830

-

-

-

Parana Technologies

USA . 127 parts In-Stock

1+ parts

-

100+ parts

$4.390

1k+ parts

-

10k+ parts

-

127

-

$4.390

-

-

Corphita

USA . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Overview

Elevate your projects with the T2035H-600IRG TRIAC from STMicroelectronics—an industry leader renowned for innovation and reliability. Designed for seamless integration, this versatile component excels in a variety of applications, from lighting control to motor management, offering exceptional performance even under challenging conditions. With its robust construction and efficient operation, this TRIAC ensures longevity and stability, empowering you to deliver superior solutions without compromise. Choose quality, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and thermal resistance, making the TRIAC suitable for various environmental conditions.

Maximum DC Gate Trigger Current: 35 mA

A maximum gate trigger current of 35 mA allows for efficient operation while minimizing power consumption, making this TRIAC energy-efficient.

Configuration: SINGLE

The single configuration simplifies circuit design and integration into devices, providing a straightforward solution for various applications.

Surface Mount: YES

Surface mount capability facilitates space-saving designs and automated assembly processes, improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier board layout and connection, aiding in the overall design flexibility.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and provides a strong mechanical connection, ensuring stability in operation.

Maximum Leakage Current: 7.4 mA

With a low maximum leakage current, this TRIAC minimizes power loss during non-conducting states, preserving energy efficiency.

No. of Terminals: 2

Having only two terminals simplifies the design and integration process, making it a practical choice for compact devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, making it ideal for applications where space is a constraint.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability and functionality in high-temperature environments.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless TRIAC means reduced complexity in circuit design, allowing for smooth and reliable operation in various applications.

Minimum Operating Temperature: -30 °C

With a broad operational temperature range, this TRIAC is suitable for diverse environments, including extremely cold applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit connections, enhancing ease of installation and versatility in design.

Maximum RMS On-state Current: 20 A

The capability to handle a maximum RMS on-state current of 20 A makes this TRIAC suitable for controlling substantial loads effectively.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage of 1.3 V allows for compatibility with low-voltage circuits, improving overall system integration.

Case Connection: ISOLATED

An isolated case connection ensures enhanced safety for the circuit and prevents unintended current paths, vital in sensitive applications.

Repetitive Peak Off-state Voltage: 600 V

The TRIAC's ability to withstand a repetitive peak off-state voltage of 600 V makes it suitable for high voltage applications, ensuring reliability.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/us

A high minimum critical rate of rise of off-state voltage offers robust protection against voltage transients, enhancing the longevity of the device.

Maximum Holding Current: 35 mA

With a maximum holding current of 35 mA, this TRIAC can reliably remain in its on-state, reducing the risk of unexpected interruptions in function.

Technical Specifications

Triode For Alternating Current (TRIAC) T2035H-600IRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSSO-G2

Maximum Leakage Current:

7.4 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

T2035H-600IRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17