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T2035H-600G-TR

STMicroelectronics

T2035H-600G-TR by STMicroelectronics

T2035H-600G-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 20 A, repetitive peak off-state voltage of 600 V, and operates b/w -30 °C to 150°C. Ideal for motor control and lighting applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,056 parts In-Stock

1+ parts

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2,056

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Anansix

USA . 1,975 parts In-Stock

1+ parts

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1,975

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Digiode

USA . 870 parts In-Stock

1+ parts

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$2.459

100+ parts

-

1k+ parts

$2.213

10k+ parts

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1,711

$2.459

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$2.213

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MKK Technologies

India . 839 parts In-Stock

1+ parts

$4.624

100+ parts

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839

$4.624

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DigiPath Technology Company

USA . 839 parts In-Stock

1+ parts

$4.624

100+ parts

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839

$4.624

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Corphita

USA . 4,938 parts In-Stock

1+ parts

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4,938

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Parana Technologies

USA . 1,669 parts In-Stock

1+ parts

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100+ parts

$2.940

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1,669

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$2.940

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Overview

Unlock unmatched reliability and performance with the T2035H-600G-TR TRIAC from STMicroelectronics, a trusted leader in semiconductor solutions. Designed for various applications, from motor control to lighting systems, this snubberless device ensures efficient power management with minimal leakage. With its robust construction and superior thermal performance, it offers exceptional durability and enhanced operational efficiency, making it the smart choice for your next project. Elevate your designs with ST’s commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and protection against environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 35 mA

A gate trigger current of 35 mA allows for efficient control, providing flexibility in circuit design and operation.

Configuration: SINGLE

The single configuration is ideal for space-constrained designs, offering a compact solution for power control.

Surface Mount: YES

Surface mount technology allows for automated assembly and saves space on the PCB, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape is optimized for board layout, facilitating easier integration into existing designs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and reliable electrical connections, crucial for performance stability.

Maximum Leakage Current: 7.4 mA

Low leakage current helps in maintaining energy efficiency and reducing power losses in circuits.

No. of Terminals: 2

With only 2 terminals, this TRIAC simplifies the design and reduces potential points of failure.

Package Style (Meter): SMALL OUTLINE

A small outline package style maximizes space efficiency, making it ideal for compact electronic devices.

Maximum Operating Temperature: 150 °C

A high operating temperature of 150 °C assures reliability in high-heat environments, extending product lifespan.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless TRIAC reduces the need for external components, streamlining circuit design and lowering costs.

Minimum Operating Temperature: -30 °C

The wide temperature range allows for operation in extreme conditions, enhancing versatility in various applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in the circuit, ensuring user-friendly integration.

Maximum RMS On-state Current: 20 A

A maximum on-state current of 20 A supports high-power applications, making it suitable for demanding load conditions.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage of 1.3 V is energy-efficient, minimizing control circuit power requirements.

Case Connection: MAIN TERMINAL 2

Main terminal connection offers straightforward wiring, ensuring reliable performance in circuits.

Repetitive Peak Off-state Voltage: 600 V

The ability to handle 600 V makes this TRIAC suitable for high-voltage applications, ensuring safety and reliability.

Minimum Critical Rate of Rise of Commutation Voltage: 300 V/us

A high critical rate of rise improves commutation performance, reducing the risk of failure in applications involving rapid voltage changes.

Maximum Holding Current: 35 mA

The low holding current requirement allows for better control in circuits, making this TRIAC a reliable choice for sensitive applications.

Technical Specifications

Triode For Alternating Current (TRIAC) T2035H-600G-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

300 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

Maximum Leakage Current:

7.4 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T2035H-600G-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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