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STW25NM60N

STMicroelectronics

STW25NM60N by STMicroelectronics

STW25NM60N from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 20A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,570 parts In-Stock

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5,570

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Digiode

USA . 4,109 parts In-Stock

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4,109

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Anansix

USA . 1,035 parts In-Stock

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1,035

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Odyssey Electronics LTD

USA . 75 parts In-Stock

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75

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ComSIT Distribution GmbH

Germany . 61 parts In-Stock

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Electronics Depot

USA . 50 parts In-Stock

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50

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IDEA Electronic Components Group

UK . 1,001 parts In-Stock

1+ parts

$1.665

100+ parts

-

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$1.499

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1,001

$1.665

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$1.499

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MKK Technologies

India . 2,121 parts In-Stock

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$3.131

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$3.131

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DigiPath Technology Company

USA . 2,121 parts In-Stock

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$3.131

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$3.131

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AZTECH Wire

Italy . 315 parts In-Stock

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$8.240

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315

$8.240

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,407 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,942 parts In-Stock

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Corphita

USA . 2,951 parts In-Stock

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Parana Technologies

USA . 840 parts In-Stock

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$1.991

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$1.991

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

USA . 29 parts In-Stock

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Overview

Unlock unparalleled efficiency with the STW25NM60N from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET is engineered for superior switching performance, making it ideal for various applications, from industrial automation to consumer electronics. Benefit from its high reliability, built-in diode, and exceptional thermal management, ensuring your designs run smoothly and efficiently. Elevate your projects with this trusted component that promises quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good thermal and mechanical stability, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher efficiency, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies circuit design by integrating a protective diode, enhancing circuit reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power in various electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures that the FET can operate reliably in high-voltage environments without failure.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, aiding in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connection and are suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs generally offer higher input impedance, resulting in lower power consumption during operation.

Maximum Pulsed Drain Current (IDM): 84 A

The capability to handle high pulsed currents makes this FET suitable for applications requiring short bursts of power.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating indicates robustness against transient conditions, enhancing reliability in diverse applications.

Maximum Drain Current (Abs) (ID): 20 A

This maximum current rating makes the FET a good choice for applications with significant current demands.

No. of Terminals: 3

Having three terminals allows for versatile circuit configurations and flexibility in design.

Maximum Power Dissipation (Abs): 160 W

A high power dissipation rating enables the device to handle substantial power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables easy attachment to heatsinks and provides better thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high switching speeds and low power consumption, making this FET an efficient choice for applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for operation in high-temperature environments, improving design flexibility.

Transistor Element Material: SILICON

Silicon materials are reliable and widely used in the industry, ensuring availability and compatibility in applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability while reducing oxidation, improving long-term reliability.

Maximum Drain Current (ID): 21 A

The capability to handle a maximum current of 21 A makes this product suitable for high-current applications.

Maximum Drain-Source On Resistance: 0.16 ohm

Low on-resistance minimizes power loss during operation, enhancing efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies assembly and arrangement on PCBs, facilitating easier integration into designs.

Technical Specifications

Power Field Effect Transistors (FET) STW25NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW25NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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