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STW20NK70Z

STMicroelectronics

STW20NK70Z by STMicroelectronics

STW20NK70Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 700V breakdown voltage, 20A max drain current, and 300W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,012 parts In-Stock

1+ parts

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4,012

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Digiode

USA . 3,417 parts In-Stock

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3,417

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Anansix

USA . 520 parts In-Stock

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520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 198 parts In-Stock

1+ parts

$1.337

100+ parts

-

1k+ parts

$1.203

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198

$1.337

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$1.203

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MKK Technologies

India . 2,314 parts In-Stock

1+ parts

$2.514

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2,314

$2.514

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DigiPath Technology Company

USA . 2,314 parts In-Stock

1+ parts

$2.514

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2,314

$2.514

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AZTECH Wire

Italy . 929 parts In-Stock

1+ parts

$18.810

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929

$18.810

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Component Stockers USA

USA . 626 parts In-Stock

1+ parts

$99.990

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626

$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 3,563 parts In-Stock

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3,563

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Corphita

USA . 824 parts In-Stock

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824

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Parana Technologies

USA . 486 parts In-Stock

1+ parts

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$1.598

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486

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$1.598

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Overview

Elevate your designs with the STW20NK70Z from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel Power FET ensures reliability and efficiency for a wide array of applications, from industrial controls to renewable energy systems. With its robust construction and superior switching capabilities, it delivers exceptional value—empowering you to optimize performance while minimizing energy consumption. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and reliability, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer higher efficiency and faster switching speeds, making this product ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse polarity, enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET optimizes power conversion and enhances control in electronic circuits.

Minimum DS Breakdown Voltage: 700 V

A high breakdown voltage makes this transistor suitable for use in high-voltage applications, providing safety and performance.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into circuit boards and improves space efficiency.

Terminal Form: THROUGH-HOLE

Through-hole mounting is robust and provides good mechanical stability, making it suitable for applications subject to vibration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 80 A

A high pulsed drain current rating means this FET can handle transient loads effectively, making it suitable for dynamic applications.

Maximum Drain Current (Abs) (ID): 20 A

The 20 A current rating ensures reliable performance for a variety of standard applications without overheating.

No. of Terminals: 3

With three terminals, this device offers simple integration into circuits, streamlining design and reducing complexity.

Maximum Power Dissipation (Abs): 300 W

The ability to dissipate up to 300 W ensures effective thermal management, allowing the FET to perform well under high-load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides strong mechanical stability and ensures optimal heat dissipation, contributing to overall device reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology delivers faster switching speeds and greater efficiency, making this FET suitable for advanced electronic applications.

Maximum Operating Temperature: 150 °C

Operating at a high temperature of 150 °C enhances reliability and allows for use in a wider range of environments.

Transistor Element Material: SILICON

Silicon offers excellent electronic properties and thermal stability, making this transistor reliable in various applications.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and enhances the long-term reliability of the connections.

Maximum Drain Current (ID): 20 A

Repeating the maximum drain current ensures consistent performance in various operational conditions.

Maximum Drain-Source On Resistance: 0.285 ohm

A low on-resistance value minimizes energy loss in the form of heat, increasing overall efficiency in power applications.

Terminal Position: SINGLE

The single terminal position simplifies layout and design, making the FET easy to incorporate into various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) STW20NK70Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.285 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW20NK70Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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