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STW26NM60ND

STMicroelectronics

STW26NM60ND by STMicroelectronics

STW26NM60ND by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. Features include 84A max pulsed drain current, 100mJ avalanche energy rating, and 0.175 ohm max on-resistance. Operating in enhancement mode, it has a max power dissipation of 190W and can handle up to 150°C operating temperature.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

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10

$1.060

-

-

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Vyrian

USA . 6,360 parts In-Stock

1+ parts

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-

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6,360

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Digiode

USA . 2,765 parts In-Stock

1+ parts

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2,765

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Anansix

USA . 931 parts In-Stock

1+ parts

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931

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Ashlea Components Ltd

UK . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,033 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

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2,033

$0.580

-

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$1.039

100+ parts

-

1k+ parts

$0.997

10k+ parts

-

2,000

$1.039

-

$0.997

-

Continental Prestige Electronics

USA . 4,943 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

$1.039

4,943

$1.060

-

-

$1.039

Argo Parts USA

USA . 2,578 parts In-Stock

1+ parts

$1.060

100+ parts

-

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2,578

$1.060

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$1.060

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-

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55

$1.060

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$1.502

100+ parts

-

1k+ parts

$1.352

10k+ parts

-

1,390

$1.502

-

$1.352

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Semicontronic

India . 856 parts In-Stock

1+ parts

$2.050

100+ parts

$1.999

1k+ parts

$1.988

10k+ parts

-

856

$2.050

$1.999

$1.988

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MKK Technologies

India . 1,744 parts In-Stock

1+ parts

$2.825

100+ parts

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1,744

$2.825

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DigiPath Technology Company

USA . 1,744 parts In-Stock

1+ parts

$2.825

100+ parts

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1,744

$2.825

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$9.866

100+ parts

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581

$9.866

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Ampacity Inc.

Singapore . 259 parts In-Stock

1+ parts

$14.050

100+ parts

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259

$14.050

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

1+ parts

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QUARKTWIN TECHNOLOGY LTD

USA . 11,864 parts In-Stock

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11,864

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Alle Elektronik GmbH

Germany . 3,235 parts In-Stock

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3,235

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Corphita

USA . 2,485 parts In-Stock

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2,485

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Perfect Parts

USA . 316 parts In-Stock

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316

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Parana Technologies

USA . 49 parts In-Stock

1+ parts

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100+ parts

$1.796

1k+ parts

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10k+ parts

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49

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$1.796

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Overview

Unleash the power of innovation with the STW26NM60ND by STMicroelectronics. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in a variety of switching applications. With a high DS Breakdown Voltage of 600V and a maximum Pulsed Drain Current of 84A, this N-CHANNEL transistor is designed for enhanced efficiency and reliability. Whether you're looking to optimize power management or streamline your electronic designs, the STW26NM60ND delivers exceptional value and benefits that will elevate your projects to new heights. Experience the difference with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance, leading to improved efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode simplifies circuit design and saves space, making it a convenient option for compact applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in controlling current flow.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into different systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing the product's reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and high switching speeds, ideal for various switching applications.

Maximum Pulsed Drain Current (IDM): 84 A

The high pulsed drain current rating allows the FET to handle sudden surges of current without damage.

Avalanche Energy Rating (EAS): 100 mJ

The FET's high avalanche energy rating ensures protection against voltage spikes and transient events.

No. of Terminals: 3

The three terminals provide flexibility in circuit design and connectivity options.

Maximum Power Dissipation (Abs): 190 W

With a high power dissipation rating, this FET can handle high power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON-resistance and high switching speeds for efficient operation.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, ensuring stable and consistent performance.

Maximum Drain Current (ID): 21 A

The high drain current rating allows the FET to handle large continuous currents effectively.

Maximum Drain-Source On Resistance: 0.175 ohm

The low ON-resistance minimizes power loss and improves efficiency in the circuit.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and ensures correct alignment in the circuit.

Case Connection: DRAIN

The drain connection allows for efficient current handling and provides a secure electrical connection.

Technical Specifications

Power Field Effect Transistors (FET) STW26NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW26NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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