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STW21NM50N

STMicroelectronics

STW21NM50N by STMicroelectronics

STW21NM50N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 500V breakdown voltage, 72A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,885 parts In-Stock

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11,885

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Digiode

USA . 4,078 parts In-Stock

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4,078

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Anansix

USA . 1,904 parts In-Stock

1+ parts

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1,904

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ComSIT Distribution GmbH

Germany . 271 parts In-Stock

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271

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Electronics Depot

USA . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,347 parts In-Stock

1+ parts

$0.744

100+ parts

-

1k+ parts

$0.670

10k+ parts

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1,347

$0.744

-

$0.670

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MKK Technologies

India . 62 parts In-Stock

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$1.400

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62

$1.400

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DigiPath Technology Company

USA . 62 parts In-Stock

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$1.400

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62

$1.400

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Component Stockers USA

USA . 5,756 parts In-Stock

1+ parts

$4.450

100+ parts

$4.230

1k+ parts

$4.090

10k+ parts

-

5,756

$4.450

$4.230

$4.090

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AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$17.620

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420

$17.620

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Kepictronics

USA . 5,400 parts In-Stock

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5,400

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Alle Elektronik GmbH

Germany . 3,458 parts In-Stock

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3,458

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 2,230 parts In-Stock

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2,230

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Parana Technologies

USA . 1,360 parts In-Stock

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$0.890

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1,360

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$0.890

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Perfect Parts

USA . 618 parts In-Stock

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618

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your projects with the STW21NM50N from STMicroelectronics, a trusted leader in semiconductor innovation. This robust N-channel power FET delivers unparalleled performance for demanding switching applications, ensuring reliability and efficiency. With a high breakdown voltage and built-in diode, it excels in various uses, from industrial to consumer electronics. Choose the STW21NM50N for exceptional quality and peace of mind that comes with STMicroelectronics' reputation for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides good insulation and durability, making the product robust for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel technology offers better performance for high-speed switching applications, making it suitable for high-efficiency designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit protection and simplifies design, reducing the overall component count.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring quick and efficient operation in electronic circuits.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage allows for safe operation in high-voltage applications, providing reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various circuit designs, ensuring versatility in application.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical support and better endurance against vibrations, especially important in industrial applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide higher efficiency and lower power loss, making them suitable for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 72 A

The ability to handle high pulsed currents makes this FET suitable for demanding switching applications.

Avalanche Energy Rating (EAS): 480 mJ

A high avalanche energy rating indicates robust protection against voltage spikes, enhancing reliability in transient conditions.

Maximum Drain Current (Abs) (ID): 18 A

A maximum drain current of 18 A allows for sufficient strength in a wide range of applications, ensuring dependable performance.

No. of Terminals: 3

Three terminals provide essential functionality while maintaining compactness, making integration simpler in various circuit designs.

Maximum Power Dissipation (Abs): 140 W

With high power dissipation capabilities, this FET can operate effectively even in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package ensures secure attachment and stable design, ideal for rigorous operational environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low gate drive power, improving overall circuit efficiency.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for use in high-temperature environments, providing more design flexibility.

Transistor Element Material: SILICON

Silicon as the material offers excellent thermal and electrical properties, ensuring reliable performance over time.

Terminal Finish: TIN

Tin finish enhances solderability and durability, ensuring long-lasting connections in electronic assemblies.

Maximum Drain Current (ID): 18 A

Reiterating the maximum drain current ensures that the product can be reliably used in various applications needing strong current handling.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance minimizes power losses during operation, making this device energy efficient and reducing heat generation.

Terminal Position: SINGLE

A single terminal position simplifies layout and design considerations in various electronic products.

Technical Specifications

Power Field Effect Transistors (FET) STW21NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

480 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW21NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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