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STW29NK50Z

STMicroelectronics

STW29NK50Z by STMicroelectronics

STW29NK50Z by STMicroelectronics is a power FET with N-channel configuration and 500V DS breakdown voltage. It is used for switching applications, offering a max pulsed drain current of 124A and an avalanche energy rating of 550mJ.

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

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$3.025

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750

$3.025

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Vyrian

USA . 4,224 parts In-Stock

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4,224

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Anansix

USA . 561 parts In-Stock

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561

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Digiode

USA . 322 parts In-Stock

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322

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Euro-Tech

UK . 48 parts In-Stock

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48

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GES GmbH

Germany . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,332 parts In-Stock

1+ parts

$0.640

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3,332

$0.640

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$0.757

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$0.681

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1,276

$0.757

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$0.681

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MKK Technologies

India . 370 parts In-Stock

1+ parts

$1.424

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370

$1.424

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DigiPath Technology Company

USA . 370 parts In-Stock

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$1.424

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370

$1.424

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Corohmni

South Africa . 107 parts In-Stock

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$1.445

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107

$1.445

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Continental Prestige Electronics

USA . 2,890 parts In-Stock

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$3.025

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$2.965

2,890

$3.025

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$2.965

Argo Parts USA

USA . 2,459 parts In-Stock

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$3.025

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$3.025

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Netroflash

USA . 2,000 parts In-Stock

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$3.025

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2,000

$3.025

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AZTECH Wire

Italy . 365 parts In-Stock

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$9.965

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365

$9.965

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Ampacity Inc.

Singapore . 1,128 parts In-Stock

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$57.050

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$57.050

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Kepictronics

USA . 12,000 parts In-Stock

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Lixinc

USA . 11,220 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,783 parts In-Stock

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Corphita

USA . 1,638 parts In-Stock

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1,638

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Parana Technologies

USA . 1,498 parts In-Stock

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$0.905

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1,498

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$0.905

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Alle Elektronik GmbH

Germany . 1,068 parts In-Stock

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1,068

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Overview

Experience the power of STMicroelectronics with the STW29NK50Z Power Field Effect Transistor (FET). Designed for switching applications, this N-CHANNEL transistor offers a minimum DS breakdown voltage of 500V, ensuring reliable performance in various environments. With a maximum pulsated drain current of 124A and a maximum power dissipation of 350W, this transistor delivers exceptional power and efficiency. Its single configuration with built-in diode simplifies installation, while its metal-oxide semiconductor technology guarantees superior quality. Whether you're building power supplies, motor drives, or industrial control systems, the STW29NK50Z is the perfect choice for your high-power needs. Trust in STMicroelectronics for outstanding performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material enhances the durability of the Power FET, making it resistant to environmental factors such as moisture and heat.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration of the Power FET enables excellent performance in switching applications, offering high efficiency and low power loss.

Configuration: SINGLE WITH BUILT-IN DIODE

The Power FET's single configuration with a built-in diode simplifies circuit design and allows for more compact and efficient switching systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power FET ensures fast and reliable switching capabilities, enabling efficient power control in electronic systems.

Minimum DS Breakdown Voltage: 500 V

With a minimum breakdown voltage of 500V, this Power FET can handle high voltage requirements, making it suitable for applications that demand robust power handling.

Package Shape: RECTANGULAR

The rectangular package shape of this Power FET provides convenient mounting options and compatibility with existing circuit layouts, facilitating a smooth integration process.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides mechanical stability, ensuring reliable and secure connections in circuit boards.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this Power FET allows for easy and efficient control of the switching characteristics, contributing to improved system performance.

No. of Elements: 1

With a single element, this Power FET offers simplicity in electrical connections, reducing potential points of failure and enhancing overall reliability.

Maximum Pulsed Drain Current (IDM): 124 A

The high maximum pulsed drain current capability of 124A enables this Power FET to handle sudden surges of power, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 550 mJ

The high avalanche energy rating of 550mJ ensures the Power FET can withstand transient energy spikes, providing robust protection against voltage surges.

Maximum Drain Current (Abs) (ID): 31 A

With a maximum drain current of 31A, this Power FET can handle high current requirements, enabling efficient power delivery and control.

No. of Terminals: 3

Having three terminals simplifies the electrical connections and facilitates easy integration with existing circuitry, making this Power FET suitable for various applications.

Maximum Power Dissipation (Abs): 350 W

The high maximum power dissipation capability of 350W ensures effective heat dissipation, allowing the Power FET to operate reliably even in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mechanical mounting options, allowing for robust and stable installation of the Power FET in electronic devices or systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology in this Power FET ensures high switching speeds, low power consumption, and excellent performance characteristics.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C enhances the thermal robustness of this Power FET, enabling it to withstand elevated temperatures in demanding environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures reliable and stable performance, providing consistent characteristics and long-term reliability.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability, ensuring secure and stable connections during circuit assembly, contributing to the overall reliability of the Power FET.

Maximum Drain-Source On Resistance: 0.13 ohm

With a maximum drain-source on resistance of 0.13 ohms, this Power FET provides low conduction losses, resulting in improved efficiency and reduced power dissipation.

Terminal Position: SINGLE

The single terminal position simplifies circuit board layout and connectivity, making it easier to incorporate this Power FET into various electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) STW29NK50Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

550 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

31 A

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

124 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW29NK50Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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