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STW21N65M5

STMicroelectronics

STW21N65M5 by STMicroelectronics

STW21N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications, featuring a 650V breakdown voltage and 68A pulsed drain current. It operates in enhancement mode with a max power dissipation of 125W. Ideal for high-efficiency power management solutions.

Median Price

$6.180

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 59 parts In-Stock

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$6.180

100+ parts

$3.559

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59

$6.180

$3.559

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Distributors (In-Stock)

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Digiode

USA . 3,397 parts In-Stock

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$3.524

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3,397

$3.524

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Vyrian

USA . 9,274 parts In-Stock

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9,274

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Anansix

USA . 814 parts In-Stock

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R&J Components

USA . 570 parts In-Stock

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570

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PC Components Company LLC

USA . 5 parts In-Stock

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5

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$0.865

100+ parts

-

1k+ parts

$0.778

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1,720

$0.865

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$0.778

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MKK Technologies

India . 1,856 parts In-Stock

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$1.626

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1,856

$1.626

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DigiPath Technology Company

USA . 1,856 parts In-Stock

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$1.626

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1,856

$1.626

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Corphita

USA . 4,875 parts In-Stock

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$3.339

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4,875

$3.339

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Microchip USA

USA . 198 parts In-Stock

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$24.960

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198

$24.960

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Alle Elektronik GmbH

Germany . 4,924 parts In-Stock

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4,924

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Parana Technologies

USA . 1,928 parts In-Stock

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$1.034

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1,928

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$1.034

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A-Z Elektronik GmbH

Germany . 1,628 parts In-Stock

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Kepictronics

USA . 1,380 parts In-Stock

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Perfect Parts

USA . 1,177 parts In-Stock

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Overview

Unlock the power of efficiency with STMicroelectronics' STW21N65M5, a superior N-channel Power FET designed for seamless switching applications. Renowned for their commitment to quality, STMicroelectronics delivers robust reliability and exceptional performance that meets the demands of modern electronics. Elevate your designs with enhanced thermal management and impressive current capabilities, ensuring your systems operate smoothly while maximizing energy savings. Discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient than P-channel counterparts, allowing for better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode simplifies circuit design and enhances protection against reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for power management and control circuits.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage ensures that the FET can operate safely in high-voltage environments, providing versatility in applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout in electronic designs and contributes to effective thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are well-suited for high-stress applications where reliability is critical.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate threshold voltages and improved energy efficiency in electronic circuits.

Maximum Pulsed Drain Current (IDM): 68 A

The ability to handle high pulsed drain currents makes this FET suitable for demanding applications requiring significant current handling.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating indicates strong performance in conditions where energy surges may occur, enhancing reliability.

Maximum Drain Current (Abs) (ID): 17 A

The capability of handling a maximum drain current of 17 A allows for efficient power control in various applications.

No. of Terminals: 3

A 3-terminal configuration simplifies connection and integration into electronic circuits.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability ensures that the FET can manage thermal loads effectively, providing reliable operation under high power conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount packages offer easy assembly and secure attachment to heat sinks, facilitating effective thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides positive voltage control and high input impedance, making this FET highly efficient.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function reliably in extreme environments, enhancing its applicability.

Transistor Element Material: SILICON

Silicon as the element material offers excellent semiconductor properties and reliability for high-performance applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, enhancing the product's longevity.

Maximum Drain Current (ID): 17 A

Ability to handle a maximum drain current of 17 A is crucial for efficient power management and reliable operation.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance minimizes power losses during operation, contributing to higher efficiency in electronic circuits.

Terminal Position: SINGLE

Single terminal position simplifies design considerations and aids in compact circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) STW21N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW21N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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