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STW24NK55Z

STMicroelectronics

STW24NK55Z by STMicroelectronics

STW24NK55Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 550V breakdown voltage, 23A max drain current, and 285W power dissipation. Ideal for high-efficiency circuits in various electronic devices.

Median Price

$11.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 600 parts In-Stock

1+ parts

$11.700

100+ parts

$7.020

1k+ parts

$6.728

10k+ parts

-

600

$11.700

$7.020

$6.728

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Vyrian

USA . 6,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,006

-

-

-

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Lakeland Logistics Inc

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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600

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-

-

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Anansix

USA . 154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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154

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-

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Digiode

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

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90

-

-

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

1+ parts

-

100+ parts

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

$0.608

10k+ parts

-

2,087

$0.675

-

$0.608

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MKK Technologies

India . 2,283 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

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2,283

$1.270

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-

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DigiPath Technology Company

USA . 2,283 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

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2,283

$1.270

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-

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$10.530

100+ parts

-

1k+ parts

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10k+ parts

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707

$10.530

-

-

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Alle Elektronik GmbH

Germany . 3,710 parts In-Stock

1+ parts

-

100+ parts

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3,710

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,062 parts In-Stock

1+ parts

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1,062

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Parana Technologies

USA . 1,034 parts In-Stock

1+ parts

-

100+ parts

$0.807

1k+ parts

-

10k+ parts

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1,034

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$0.807

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Perfect Parts

USA . 562 parts In-Stock

1+ parts

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562

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Overview

Elevate your projects with the STW24NK55Z from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel Power FET stands out with its exceptional reliability and efficiency, making it perfect for demanding switching applications. Designed to handle high voltages and currents with ease, it ensures optimal performance while reducing thermal stress, delivering unmatched value and peace of mind across industrial and consumer electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility, leading to improved performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation in various circuit designs, enhancing versatility.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power in electronic circuits.

Minimum DS Breakdown Voltage: 550 V

With a high breakdown voltage, this FET is well-suited for high voltage applications, ensuring reliable performance.

Package Shape: RECTANGULAR

Rectangular packages are standard for power components, making integration into PCBs easier.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, ideal for applications requiring reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low standby power consumption and efficient switching capabilities.

Maximum Pulsed Drain Current (IDM): 92 A

The ability to handle high pulsed drain currents makes this FET suitable for demanding applications.

Avalanche Energy Rating (EAS): 400 mJ

With a high avalanche energy rating, the FET can withstand transient conditions, increasing overall reliability.

Maximum Drain Current (Abs) (ID): 23 A

A maximum drain current of 23 A allows it to cater to applications requiring substantial current handling.

No. of Terminals: 3

Having 3 terminals allows for flexibility in design while ensuring compact integration within circuits.

Maximum Power Dissipation (Abs): 285 W

High power dissipation capability facilitates effective thermal management in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures stable installation and good thermal dissipation in industrial environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in low power consumption and fast switching speeds, making this FET highly efficient.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows this FET to perform reliably in demanding conditions.

Transistor Element Material: SILICON

Silicon is a commonly used material in FETs, providing stability and consistency in performance.

Maximum Drain Current (ID): 23 A

Reiterating the maximum drain current ensures customers know the product can handle high currents effectively.

Maximum Drain-Source On Resistance: 0.22 ohm

Low on-resistance translates to lower power losses and higher efficiency during operation.

Terminal Position: SINGLE

A single terminal position simplifies circuit layouts and enhances integration flexibility.

Technical Specifications

Power Field Effect Transistors (FET) STW24NK55Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

550 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

92 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW24NK55Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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