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STV8218/T

STMicroelectronics

STV8218/T by STMicroelectronics

STV8218/T from STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates within a voltage range of 1.7-1.9 V and features an 80-terminal gull-wing package, suitable for compact designs. With a max temp of 70 °C, it's ideal for various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,308 parts In-Stock

1+ parts

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2,308

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Vyrian

USA . 1,812 parts In-Stock

1+ parts

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1,812

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Anansix

USA . 1,678 parts In-Stock

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1,678

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 513 parts In-Stock

1+ parts

$1.875

100+ parts

-

1k+ parts

$1.687

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513

$1.875

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$1.687

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MKK Technologies

India . 2,083 parts In-Stock

1+ parts

$3.526

100+ parts

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2,083

$3.526

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$3.526

100+ parts

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2,083

$3.526

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Corphita

USA . 313 parts In-Stock

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313

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Parana Technologies

USA . 58 parts In-Stock

1+ parts

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$2.242

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58

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$2.242

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Overview

Unlock the potential of your consumer electronics with the STV8218/T from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a low-profile solution ideal for a range of applications. With superior performance in compact designs, this integrated circuit enhances efficiency and reliability, ensuring your devices operate seamlessly. Experience the advantage of cutting-edge technology that empowers your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy not only ensures durability but also contributes to a lightweight design, making the IC easier to integrate into various applications.

Surface Mount: YES

Surface mount capability allows for efficient usage of PCB space, facilitating higher density designs which are crucial for modern electronics.

Package Shape: SQUARE

A square package shape optimizes space and simplifies layout designs, enhancing flexibility in circuit design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is tailored to meet the performance demands of everyday devices.

Power Supplies (V): 1.8/3.3, 8

Supports a range of power supply voltages, compatible with a variety of applications, aiding in reducing design complexity.

No. of Terminals: 80

With 80 terminals, this IC offers extensive connectivity options, making it ideal for complex functionalities in consumer electronics.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design allows for sleek integration into space-constrained applications, contributing to overall device aesthetics.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates reliability and stability even under moderate thermal stress conditions.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C ensures usability in a wide range of environments and applications.

Terminal Position: QUAD

Quad terminal positioning fosters efficient circuit design and enhances performance through minimal inductance and capacitance.

Maximum Seated Height: 1.6 mm

A low seated height allows for compact design solutions, ideal for portable and slim devices.

Width: 14 mm

Compact width aids in fitting the IC in confined spaces, enhancing design flexibility for engineers.

Minimum Supply Voltage (Vsup): 1.7 V

A low minimum supply voltage enhances compatibility with battery-operated devices, leading to longer operational lifetimes.

Length: 14 mm

Standard length aligns with common PCB layouts, simplifying design and reducing production costs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the IC can perform reliably in typical consumer environments, perfect for everyday consumer products.

Terminal Form: GULL WING

Gull wing terminals facilitate a more reliable soldering process, improving the overall quality of connections.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch allows for denser layouts which are essential for modern electronic design, making it suitable for high-performance applications.

Maximum Supply Voltage (Vsup): 1.9 V

The maximum supply voltage ensures compatibility across a range of applications, providing flexibility for varied electronic designs.

Technical Specifications

Other Function Consumer ICs STV8218/T attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

1.8/3.3, 8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8218/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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