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STV8216

STMicroelectronics

STV8216 by STMicroelectronics

STV8216 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w 3-3.6V, features 80 terminals in a quad configuration, and withstands temperatures from 0 °C to 70 °C. Ideal for compact electronic devices, it ensures reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,663 parts In-Stock

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3,663

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Vyrian

USA . 2,198 parts In-Stock

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2,198

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Anansix

USA . 1,735 parts In-Stock

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1,735

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ComSIT Distribution GmbH

Germany . 1,620 parts In-Stock

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1,620

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Cyclops Electronics Ltd

UK . 1,079 parts In-Stock

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1,079

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ACDS - Activité Composants Distribution Service

France . 76 parts In-Stock

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76

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Goldney Electronics S.L.

Spain . 1 parts In-Stock

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1

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 868 parts In-Stock

1+ parts

$0.251

100+ parts

-

1k+ parts

$0.226

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868

$0.251

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$0.226

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MKK Technologies

India . 73 parts In-Stock

1+ parts

$0.472

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73

$0.472

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DigiPath Technology Company

USA . 73 parts In-Stock

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$0.472

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73

$0.472

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Microchip USA

USA . 312 parts In-Stock

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$8.853

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312

$8.853

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AZTECH Wire

Italy . 1,130 parts In-Stock

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$13.440

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$13.440

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RC Electronics

USA . 7,378 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,522 parts In-Stock

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GreenTree Electronics

Israel . 4,759 parts In-Stock

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Corphita

USA . 4,662 parts In-Stock

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4,662

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Parana Technologies

USA . 1,791 parts In-Stock

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$0.300

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1,791

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$0.300

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Kepictronics

USA . 1,080 parts In-Stock

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1,080

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Overview

Unlock endless possibilities with the STV8216 from STMicroelectronics, a top-tier choice for consumer circuit applications. Designed for reliability and performance, this compact, low-profile IC ensures seamless integration into your devices. With its robust build and efficient power handling, the STV8216 enhances functionality while maintaining optimal operating conditions. Elevate your projects with a trusted manufacturer known for innovation and quality—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and insulation, making this IC suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic devices, enhancing manufacturing efficiency.

Package Shape: SQUARE

The square package shape optimizes space usage on the PCB, facilitating better layout designs for high-density applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in common electronic devices.

Power Supplies (V): 3.3,8

Supporting multiple supply voltages enhances versatility, allowing this IC to be used across a range of devices without requiring additional voltage regulation.

No. of Terminals: 80

With 80 terminals, the IC can handle multiple connections, providing comprehensive functionality for complex consumer applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design minimizes space requirements in final products, making it ideal for compact consumer electronics.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in typical consumer environments, supporting device longevity.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C makes this IC suitable for use in a range of environments, even in cooler conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and conductivity, ensuring reliable connections and extended product life.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of space on PCB, improving overall circuit layout design.

Maximum Seated Height: 1.6 mm

With a low seated height, this IC is suited for slim-profile electronic devices, meeting modern design requirements.

Width: 14 mm

The 14 mm width strikes a balance between performance and compactness, making it adaptable to various consumer applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V allows for operation in many battery-powered devices, promoting energy efficiency.

Length: 14 mm

A matched length of 14 mm provides a square footprint, simplifying PCB design and placement.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, this IC meets the requirements of consumer electronics, ensuring reliable performance in everyday use.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy soldering and improves reliability in surface-mount applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is standard for many manufacturing processes, making it compatible with automated assembly lines.

Maximum Supply Voltage (Vsup): 3.6 V

The IC's capability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options, accommodating various designs.

Technical Specifications

Other Function Consumer ICs STV8216 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 7.6V TO 8.4V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3,8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8216 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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