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STV8207/T

STMicroelectronics

STV8207/T by STMicroelectronics

STV8207/T by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates within a voltage range of 1.8-3.3V, features 80 terminals in a quad configuration, and withstands temperatures from 0 °C to 70 °C. Ideal for compact electronic devices, it ensures efficient performance in various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,374 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,374

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-

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Vyrian

USA . 1,854 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,854

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Anansix

USA . 969 parts In-Stock

1+ parts

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969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$3.631

100+ parts

-

1k+ parts

$3.268

10k+ parts

-

289

$3.631

-

$3.268

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MKK Technologies

India . 2,322 parts In-Stock

1+ parts

$6.828

100+ parts

-

1k+ parts

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10k+ parts

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2,322

$6.828

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DigiPath Technology Company

USA . 2,322 parts In-Stock

1+ parts

$6.828

100+ parts

-

1k+ parts

-

10k+ parts

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2,322

$6.828

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Parana Technologies

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

$4.342

1k+ parts

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1,642

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$4.342

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Corphita

USA . 277 parts In-Stock

1+ parts

-

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277

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Overview

Unlock the potential of your designs with the STV8207/T from STMicroelectronics—an industry leader renowned for innovation and reliability. This versatile consumer IC enhances performance while ensuring minimal space usage, thanks to its low-profile flatpack design. With superior power flexibility and outstanding durability, it’s ideal for a range of applications—from smart devices to audio systems—delivering unmatched value and efficiency to elevate your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy integration into compact designs and enhances assembly efficiency.

Package Shape: SQUARE

The square shape aids in efficient space utilization on PCBs, making it suitable for various applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for performance in everyday electronic devices.

Power Supplies (V): 1.8, 3.3, 8

Supports multiple supply voltage options, providing flexibility in design and compatibility with different system requirements.

No. of Terminals: 80

With 80 terminals, this IC offers a high degree of connectivity, enabling complex functionalities in consumer electronics.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low-profile design is ideal for applications where space is at a premium, facilitating integration into sleek devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in various ambient conditions typical for consumer applications.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C expands its usability in diverse environments, enhancing versatility.

Terminal Position: QUAD

Quad terminal positioning supports diverse layout requirements, making it easier to design PCBs around this IC.

Maximum Seated Height: 1.6 mm

A low seated height contributes to compact designs, making it suitable for mobile and space-constrained applications.

Width: 14 mm

The 14 mm width is compatible with standard PCB layouts, simplifying the design and assembly processes.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage of 1.7 V allows for operation in low-power applications, improving energy efficiency.

Length: 14 mm

The uniform dimensions (14 mm length) allow for easy placement and integration into existing PCB footprints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures this IC is suitable for a wide range of consumer applications, providing reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical stability and ease of soldering, enhancing manufacturing reliability.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for high-density connections, facilitating advanced functionality in compact designs.

Maximum Supply Voltage (Vsup): 1.9 V

A maximum supply voltage of 1.9 V supports various power needs, ensuring the IC can perform effectively in different configurations.

Technical Specifications

Other Function Consumer ICs STV8207/T attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

1.8,3.3,8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8207/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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