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STV8217/T

STMicroelectronics

STV8217/T by STMicroelectronics

STV8217/T from STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates within a voltage range of 1.8-3.3V, features 80 terminals in a quad configuration, and withstands temperatures up to 70 °C. Ideal for compact electronic devices, it ensures reliable performance in various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,848 parts In-Stock

1+ parts

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4,848

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Vyrian

USA . 4,307 parts In-Stock

1+ parts

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4,307

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Anansix

USA . 1,997 parts In-Stock

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1,997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,105 parts In-Stock

1+ parts

$1.789

100+ parts

-

1k+ parts

$1.610

10k+ parts

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1,105

$1.789

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$1.610

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MKK Technologies

India . 1,840 parts In-Stock

1+ parts

$3.365

100+ parts

-

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1,840

$3.365

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DigiPath Technology Company

USA . 1,840 parts In-Stock

1+ parts

$3.365

100+ parts

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10k+ parts

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1,840

$3.365

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A-Z Elektronik GmbH

Germany . 5,592 parts In-Stock

1+ parts

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5,592

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GreenTree Electronics

Israel . 4,600 parts In-Stock

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4,600

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Parana Technologies

USA . 2,177 parts In-Stock

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100+ parts

$2.140

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2,177

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$2.140

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Corphita

USA . 1,006 parts In-Stock

1+ parts

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1,006

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 362 parts In-Stock

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362

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Overview

Unlock the potential of your consumer electronics with the STV8217/T from STMicroelectronics. Renowned for excellence in semiconductor innovation, STMicroelectronics delivers this compact and versatile IC designed to elevate your device’s performance. Its low-profile design ensures seamless integration, while its robust power supply options cater to a variety of applications. Experience enhanced efficiency and reliability, making it the perfect choice for cutting-edge consumer products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures resilience and protection against environmental factors, enhancing the longevity of the product.

Surface Mount: YES

Surface mount compatibility allows for easier integration into modern PCB designs, saving space and improving assembly efficiency.

Package Shape: SQUARE

The square shape is ideal for compact circuit designs, helping to optimize board layout and minimize footprint.

General IC Type: CONSUMER CIRCUIT

Tailored for consumer applications, this IC meets the specific needs of the market, ensuring reliable performance.

Power Supplies (V): 1.8, 3.3, 8

Versatile operating voltage range supports diverse applications and can accommodate multiple system requirements.

No. of Terminals: 80

A higher number of terminals enhances connectivity and functionality, allowing for more complex designs and features.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design minimizes height, making it suitable for space-constrained applications and providing an aesthetic appeal.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is robust enough for varied environmental conditions.

Minimum Operating Temperature: 0 °C

The IC's capability to function from 0 °C allows it to be used in a wider range of applications, including outdoor devices.

Terminal Position: QUAD

Quad terminal positioning enables efficient connections and enhances the device's adaptability in various mounting scenarios.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a compact overall design, perfect for applications where space is at a premium.

Width: 14 mm

The compact width allows for efficient use of PCB space, facilitating easier layout designs without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage ensures energy efficiency, making this IC suitable for battery-operated devices.

Length: 14 mm

Similar to the width, the length of 14 mm contributes to a uniform footprint, aiding in effective circuit design.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliability for standard consumer applications without the stringent requirements of industrial-grade components.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, enhancing the IC's durability and performance in electronic applications.

Terminal Pitch: 0.65 mm

A pitch of 0.65 mm allows for efficient routing on PCBs, promoting compact designs without compromising on performance.

Maximum Supply Voltage (Vsup): 1.9 V

The ability to accommodate a maximum supply voltage of 1.9 V increases compatibility with various power supplies in consumer electronics.

Technical Specifications

Other Function Consumer ICs STV8217/T attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

1.8,3.3,8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8217/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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