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STV8226

STMicroelectronics

STV8226 by STMicroelectronics

STV8226 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w 3-3.6V, features 80 terminals in a quad configuration, and withstands temperatures from 0 °C to 70 °C. Ideal for compact electronic devices requiring efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,688 parts In-Stock

1+ parts

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4,688

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Digiode

USA . 1,911 parts In-Stock

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1,911

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Anansix

USA . 1,316 parts In-Stock

1+ parts

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1,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 182 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

$1.094

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182

$1.215

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$1.094

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MKK Technologies

India . 1,723 parts In-Stock

1+ parts

$2.285

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1,723

$2.285

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DigiPath Technology Company

USA . 1,723 parts In-Stock

1+ parts

$2.285

100+ parts

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1,723

$2.285

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Corphita

USA . 4,513 parts In-Stock

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4,513

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Parana Technologies

USA . 1,141 parts In-Stock

1+ parts

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100+ parts

$1.453

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1,141

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$1.453

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Overview

Unlock a world of possibilities with the STV8226 by STMicroelectronics, a leader in innovation and quality. This versatile consumer IC enhances your designs with reliable performance in compact devices, making it ideal for various applications from home automation to portable electronics. With its low-profile package and robust specifications, the STV8226 ensures seamless integration and long-lasting durability, empowering you to deliver exceptional products that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and improved manufacturing efficiency.

Package Shape: SQUARE

A square package shape provides uniform dimensions, making it easier to handle and place on PCBs.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, it is tailored for use in everyday electronics, ensuring compatibility with a wide range of devices.

Power Supplies (V): 3.3, 8

The ability to operate on varying power supply levels (3.3V and 8V) enhances flexibility in design and application.

No. of Terminals: 80

A higher number of terminals allows for complex functionality and integration into advanced systems.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design contributes to space-saving on circuit boards, which is critical for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product is suitable for a variety of consumer environments without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable performance in standard temperature ranges.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures long-term reliability in connections.

Terminal Position: QUAD

The quad terminal position allows for efficient layout and routing on the PCB, simplifying design processes.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to low-profile designs, essential for modern electronic devices.

Width: 14 mm

The compact width of 14 mm allows for dense packing of components, beneficial in space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V enables integration into low-power systems, enhancing energy efficiency.

Length: 14 mm

The length of 14 mm matches the width, maintaining a uniform footprint for consistent performance and layout.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures suitability for general-use applications with standard performance requirements.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ensure reliable solder joints.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density soldering and is compatible with modern PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V offers flexibility in powering devices while protecting against overvoltage conditions.

Technical Specifications

Other Function Consumer ICs STV8226 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 7.6V TO 8.4V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3,8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8226 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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