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STV8218F

STMicroelectronics

STV8218F by STMicroelectronics

STV8218F by STMicroelectronics is a low-profile consumer IC with a 1.8/3.3V power supply and operates b/w 0 °C to 70 °C. It features a compact 14mm square package with 100 terminals, ideal for space-constrained applications. Its matte tin terminals ensure reliable connections in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,914

-

-

-

-

Vyrian

USA . 3,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,369

-

-

-

-

Anansix

USA . 438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

438

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$3.343

100+ parts

-

1k+ parts

$3.009

10k+ parts

-

1,031

$3.343

-

$3.009

-

MKK Technologies

India . 1,279 parts In-Stock

1+ parts

$6.287

100+ parts

-

1k+ parts

-

10k+ parts

-

1,279

$6.287

-

-

-

DigiPath Technology Company

USA . 1,279 parts In-Stock

1+ parts

$6.287

100+ parts

-

1k+ parts

-

10k+ parts

-

1,279

$6.287

-

-

-

Corphita

USA . 4,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,577

-

-

-

-

Parana Technologies

USA . 158 parts In-Stock

1+ parts

-

100+ parts

$3.997

1k+ parts

-

10k+ parts

-

158

-

$3.997

-

-

Overview

Unlock unparalleled performance with the STV8218F from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile consumer IC is designed for efficiency and reliability, making it ideal for a range of applications from home electronics to industrial devices. With its low-profile design, exceptional thermal stability, and superior power management, the STV8218F ensures your systems run smoothly, empowering you to deliver quality solutions that meet today's demanding market needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection from environmental factors, enhancing the lifespan of the IC.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square shape provides efficient use of PCB space and simplifies layout design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring functionality tailored for everyday electronics.

Power Supplies: 1.8/3.3, 8 V

Supports multiple supply voltages, making it versatile for various consumer electronic devices.

No. of Terminals: 100

A higher number of terminals allows for increased functionality and connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design is excellent for modern slim devices, promoting integration into compact circuits.

Maximum Operating Temperature: 70 °C

Operating at this temperature ensures reliability in normal consumer environments.

Minimum Operating Temperature: 0 °C

This range guarantees performance even in colder conditions, making it suitable for various climates.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and ensures robust connections, enhancing assembly reliability.

Terminal Position: QUAD

Quad terminal positioning allows for better access and simplified layout on printed circuit boards.

Maximum Seated Height: 1.6 mm

A low seated height facilitates the design of thin and compact devices.

Width: 14 mm

Standard width provides compatibility with a variety of PCB layouts, enhancing usability.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage contributes to energy efficiency, ideal for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30 s

A short peak reflow time reduces component stress during assembly, promoting component integrity.

Peak Reflow Temperature: 250 °C

This peak temperature is suitable for soldering processes, ensuring reliable connections in manufacturing.

Length: 14 mm

A uniform length alongside the standard width enhances compatibility across various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade signifies reliability for everyday applications in consumer electronics.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process, providing robust connections that can withstand thermal stress.

Terminal Pitch: 0.5 mm

A fine pitch allows for increased terminal density, maximizing functionality in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a reasonable level of moisture resistance, facilitating ease of handling and assembly.

Maximum Supply Voltage (Vsup): 1.9 V

The maximum supply voltage expands usage scenarios, accommodating devices requiring slightly higher voltages.

Technical Specifications

Other Function Consumer ICs STV8218F attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.8/3.3, 8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

STV8218F General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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