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STV8218F/T

STMicroelectronics

STV8218F/T by STMicroelectronics

STV8218F/T by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates within a supply voltage range of 1.7-1.9 V and features 100 terminals in a quad gull-wing configuration. With a max temp of 70 °C, it's ideal for various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,709 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,709

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-

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Anansix

USA . 1,558 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,558

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Vyrian

USA . 398 parts In-Stock

1+ parts

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100+ parts

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398

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,246 parts In-Stock

1+ parts

$3.461

100+ parts

-

1k+ parts

$3.115

10k+ parts

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1,246

$3.461

-

$3.115

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MKK Technologies

India . 108 parts In-Stock

1+ parts

$6.508

100+ parts

-

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108

$6.508

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DigiPath Technology Company

USA . 108 parts In-Stock

1+ parts

$6.508

100+ parts

-

1k+ parts

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108

$6.508

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-

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Corphita

USA . 1,467 parts In-Stock

1+ parts

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1,467

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Parana Technologies

USA . 611 parts In-Stock

1+ parts

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100+ parts

$4.138

1k+ parts

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10k+ parts

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611

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$4.138

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Overview

Unlock unparalleled performance with the STV8218F/T from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This sleek, low-profile consumer IC is designed for versatility and reliability across various applications, ensuring optimal efficiency in your electronic projects. With robust quality and innovative design, the STV8218F/T offers seamless integration, reduced power consumption, and exceptional thermal stability—empowering you to elevate your designs and deliver superior products that stand out in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability, making the IC suitable for various consumer applications.

Surface Mount: YES

The surface mount capability allows for compact device design and efficient space utilization on PCBs, enhancing manufacturing flexibility.

Package Shape: SQUARE

The square shape of the package provides uniform geometric compatibility for diverse circuit layouts, facilitating integration.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC offers tailored performance for popular electronic devices.

Power Supplies (V): 1.8/3.3, 8

Supports multiple voltage levels, allowing for versatile integration across a range of electronic products.

No. of Terminals: 100

With 100 terminals, this IC can handle complex circuit requirements, making it suitable for high-performance applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design are advantageous for modern slim devices, optimizing space and performance.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance in a wide range of environments.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows the IC to function well in cooler conditions, broadening its application range.

Terminal Position: QUAD

Quad terminal positioning improves connection stability and ensures robustness in circuit assembly.

Maximum Seated Height: 1.6 mm

The low seated height allows for enhanced airflow and cooling in compact designs, crucial for performance.

Width: 14 mm

A standardized width of 14 mm makes it compatible with a variety of board layouts and designs.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement allows for energy-efficient designs, prolonging battery life in portable applications.

Length: 14 mm

The consistent length of 14 mm supports straightforward integration into standard circuit designs.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, this IC is suitable for consumer electronics subjected to everyday conditions.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and ensures strong connections on PCBs.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for dense routing on PCBs, maximizing design efficiency.

Maximum Supply Voltage (Vsup): 1.9 V

Supports a maximum supply voltage of 1.9 V, enabling high-performance operation without power constraints.

Technical Specifications

Other Function Consumer ICs STV8218F/T attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8/3.3, 8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8218F/T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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