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STV8218

STMicroelectronics

STV8218 by STMicroelectronics

STV8218 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w 1.7V and 1.9V, features an 80-terminal gull-wing design, and withstands temperatures from 0 °C to 70 °C. Ideal for compact electronic devices requiring efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,886 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,886

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Vyrian

USA . 2,267 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,267

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Digiode

USA . 1,844 parts In-Stock

1+ parts

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100+ parts

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1,844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 394 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

$1.215

10k+ parts

-

394

$1.350

-

$1.215

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MKK Technologies

India . 368 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

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10k+ parts

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368

$2.538

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DigiPath Technology Company

USA . 368 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

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10k+ parts

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368

$2.538

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-

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A-Z Elektronik GmbH

Germany . 4,832 parts In-Stock

1+ parts

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4,832

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Corphita

USA . 4,212 parts In-Stock

1+ parts

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4,212

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GreenTree Electronics

Israel . 3,230 parts In-Stock

1+ parts

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3,230

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Parana Technologies

USA . 1,790 parts In-Stock

1+ parts

-

100+ parts

$1.614

1k+ parts

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1,790

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$1.614

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Unlock unparalleled performance with the STV8218 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile consumer IC is designed for seamless integration into cutting-edge applications, offering exceptional reliability and efficiency. With its low-profile package and robust temperature resilience, the STV8218 empowers your devices to excel in any environment, ensuring enhanced user experiences and driving your projects toward success. Experience the value of quality and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective, this material enhances the reliability of the IC under various conditions, making it suitable for consumer applications.

Surface Mount: YES

Surface mount technology allows for reduced board space and improved manufacturing efficiency, making the product ideal for compact devices.

Package Shape: SQUARE

A square package design provides uniformity in layouts and simplifies PCB design and assembly processes.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring optimal performance in everyday electronic devices.

Power Supplies (V): 1.8/3.3, 8

Flexible power supply options allow compatibility with a wide range of systems and devices, enhancing versatility.

No. of Terminals: 80

A higher number of terminals allows for more features and connectivity options, suitable for complex consumer electronics.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is advantageous for space-constrained applications, allowing easier integration into compact devices.

Maximum Operating Temperature: 70 °C

This temperature limit ensures reliable operation in environments that can heat up during use, preserving performance and longevity.

Minimum Operating Temperature: 0 °C

Operational capability in low temperatures expands the usability range of the device in various environments.

Terminal Position: QUAD

Quad terminal positioning aids in improving electrical performance and signal integrity, which is crucial in high-frequency applications.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for minimizing overall device thickness, making it attractive for slim electronics.

Width: 14 mm

Compact width contributes to efficient use of PCB space, facilitating design in tight-fit applications.

Minimum Supply Voltage (Vsup): 1.7 V

This low voltage requirement allows for energy-efficient designs and helps in reducing overall power consumption.

Length: 14 mm

Compact length complements the width for a square design, aiding in efficient board layout.

Temperature Grade: COMMERCIAL

Commercial-grade components are designed for a range of everyday applications, ensuring broad market applicability.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and better mechanical strength, enhancing the durability of the assembled PCB.

Terminal Pitch: 0.65 mm

A tighter terminal pitch enables higher density layouts, perfect for advanced consumer electronics with compact size requirements.

Maximum Supply Voltage (Vsup): 1.9 V

Providing a slightly higher maximum voltage enhances the range of compatible systems, expanding its usability across different applications.

Technical Specifications

Other Function Consumer ICs STV8218 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 3.13V TO 3.47V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

1.8/3.3, 8

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV8218 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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