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STR752FR2H7

STMicroelectronics

STR752FR2H7 by STMicroelectronics

STR752FR2H7 from STMicroelectronics is a 32-bit ARM7 microcontroller designed for industrial applications, featuring a max supply voltage of 5.5V and operating temp range of -40 °C to 105 °C. It includes 64 terminals, ADC, DMA, and PWM channels for versatile functionality. With a flash ROM of 262144 words and RAM of 16384 bytes, it supports efficient processing at up to 60 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,934 parts In-Stock

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3,934

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Vyrian

USA . 3,207 parts In-Stock

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3,207

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Anansix

USA . 2,856 parts In-Stock

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2,856

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 179 parts In-Stock

1+ parts

$11.097

100+ parts

-

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179

$11.097

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AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$22.040

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774

$22.040

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IDEA Electronic Components Group

UK . 2,237 parts In-Stock

1+ parts

$67.659

100+ parts

-

1k+ parts

$60.893

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2,237

$67.659

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$60.893

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MKK Technologies

India . 1,844 parts In-Stock

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$127.228

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1,844

$127.228

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DigiPath Technology Company

USA . 1,844 parts In-Stock

1+ parts

$127.228

100+ parts

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1,844

$127.228

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Corphita

USA . 3,588 parts In-Stock

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3,588

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Parana Technologies

USA . 1,692 parts In-Stock

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$80.896

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1,692

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$80.896

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Overview

Unlock unparalleled performance and reliability with the STR752FR2H7 microcontroller from STMicroelectronics. Renowned for their excellence in semiconductor solutions, STMicroelectronics delivers this high-quality ARM7-based device that thrives in demanding industrial environments. With its low-profile design and versatile I/O options, this microcontroller is perfect for automation, IoT devices, and advanced control systems, ensuring your projects are not just completed, but excel in efficiency and durability. Choose STR752FR2H7 for unmatched value and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures excellent environmental resistance and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into automated circuit assembly processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply designs while maintaining safe operating conditions.

Package Shape: SQUARE

The square package shape contributes to efficient space utilization on PCB layouts, enabling high-density designs.

Bit Size: 32

A 32-bit architecture offers enhanced processing capabilities and allows for handling larger data types and complex operations.

Power Supplies: 3.3/5

Supports both 3.3V and 5V supply levels, making it compatible with a wide range of existing electronic systems.

No. of Terminals: 64

With 64 terminals available, it allows for extensive I/O options which are essential for complex applications and interfacing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style facilitates efficient thermal performance and signal integrity in confined spaces.

Minimum Supply Voltage: 4.5 V

Allows for operation in varying voltage conditions, making it suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

With a higher operating temperature range, this microcontroller is suitable for industrial applications and environments.

CPU Family: ARM7

The ARM7 CPU family provides a well-known architecture that combines performance and power efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature operating range ensures reliable performance in extreme conditions, suitable for outdoor and industrial use.

ADC Channels: YES

Built-in ADC channels facilitate analog signal processing, enhancing the microcontroller’s versatility for sensor applications.

DMA Channels: YES

DMA support enables efficient data transfer, freeing the CPU for other tasks and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for certain PCB designs, allowing for optimized space and layout.

ROM Words: 262144

A significant ROM size allows for larger programs and complex firmware, increasing the functionality of embedded applications.

Maximum Seated Height: 1.7 mm

A low seated height enables compact design solutions where space is limited, ideal for modern electronics.

Width: 8 mm

A manageable width size allows for easy incorporation into various device designs without compromising on performance.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz supports fast processing, ensuring responsive and efficient operations.

Length: 8 mm

Standard length means better compatibility with existing footprints and makes it easier to design PCBs.

Temperature Grade: INDUSTRIAL

Industrial grade components are designed to perform reliably over long periods, making them suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it operates with higher performance at lower power consumption, making it efficient for embedded tasks.

RAM Bytes: 16384

Adequate RAM size supports more complex operations and larger data management needs in applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring longevity and stability in operations.

Terminal Form: BALL

Ball terminal forms enable easier soldering and better electrical performance in high-density configurations.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a common standard, ensuring compatibility with many peripheral devices.

PWM Channels: YES

The inclusion of PWM channels is beneficial for applications requiring motor control, dimming, or other analog modulation techniques.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updates to firmware, providing long-term usability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is a standard size that ensures compatibility with various mounting technologies and facilitates soldering.

Speed: 48 rpm

Offers adequate control for low-speed applications or systems where gentle motor control is required.

No. of I/O Lines: 38

With 38 I/O lines, this microcontroller can efficiently communicate with multiple devices, sensors, and peripherals in complex systems.

Technical Specifications

Microcontrollers STR752FR2H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of I/O Lines:

38

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR752FR2H7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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