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STR752FR0T6

STMicroelectronics

STR752FR0T6 by STMicroelectronics

STR752FR0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, supports CAN/I2C/SPI/UART connectivity, and includes ADC/DMA capabilities for versatile applications. Ideal for industrial automation and control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,764 parts In-Stock

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3,764

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Anansix

USA . 2,537 parts In-Stock

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2,537

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Digiode

USA . 2,515 parts In-Stock

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2,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,990 parts In-Stock

1+ parts

$8.169

100+ parts

-

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1,990

$8.169

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$20.710

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-

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723

$20.710

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IDEA Electronic Components Group

UK . 722 parts In-Stock

1+ parts

$36.208

100+ parts

-

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$32.587

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722

$36.208

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$32.587

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MKK Technologies

India . 299 parts In-Stock

1+ parts

$68.086

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299

$68.086

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DigiPath Technology Company

USA . 299 parts In-Stock

1+ parts

$68.086

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299

$68.086

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QUARKTWIN TECHNOLOGY LTD

USA . 14,004 parts In-Stock

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Corphita

USA . 2,068 parts In-Stock

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2,068

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Parana Technologies

USA . 731 parts In-Stock

1+ parts

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$43.292

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731

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$43.292

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Overview

Unlock your project's potential with the STR752FR0T6 microcontroller from STMicroelectronics, a leader in innovative solutions. Designed for versatility and high performance, this 32-bit ARM7 powerhouse excels in industrial applications, ensuring reliability in harsh conditions. Enjoy seamless connectivity options and advanced features like DMA and PWM, empowering you to create smart, efficient designs. Elevate your technology with unmatched quality and support from a trusted manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures robustness and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

The wide voltage range provides flexibility for various power supply configurations.

Package Shape: SQUARE

The square package shape aids in efficient space utilization on circuit boards.

Bit Size: 32

A 32-bit architecture allows for higher processing power and better performance, making it suitable for demanding applications.

Power Supplies: 3.3/5 V

Support for both 3.3V and 5V power supplies makes it adaptable for various designs and components.

No. of Terminals: 64

Having 64 terminals expands connectivity and I/O capabilities, enabling complex functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for low profile mounting, ideal for space-constrained designs.

Minimum Supply Voltage: 4.5 V

The flexibility in supply voltage ensures stable operation in varying conditions.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperatures makes it suitable for industrial and intricate environments.

CPU Family: ARM7

ARM7 family provides a strong ecosystem, with extensive documentation and community support.

Minimum Operating Temperature: -40 °C

This wide temperature range supports usage in extreme conditions, ideal for outdoor or rough applications.

Terminal Finish: MATTE TIN

Matte tin finish aids in soldering, improving reliability and reducing contact resistance.

ADC Channels: YES

On-chip ADC channels enable efficient data acquisition from analog sensors, vital for real-time applications.

DMA Channels: YES

Dedicated DMA channels enhance data transfer efficiency, allowing for faster and more effective processing.

Terminal Position: QUAD

Quad terminal positions facilitate better connections and signal integrity.

ROM Words: 65536

A substantial ROM size allows for complex programs and increased functionality.

Maximum Seated Height: 1.6 mm

Low seated height promotes space efficiency in compact designs.

Width: 10 mm

The compact width aids in high-density PCB design, making it suitable for portable applications.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

An extensive range of peripherals supports varied functionalities, enhancing the controller's versatility.

Maximum Clock Frequency: 60 MHz

A high clock frequency indicates greater processing speed, enabling complex computations.

Length: 10 mm

The compact length allows easy integration into space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial grade applications, ensuring reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, enhancing performance and power efficiency.

RAM Bytes: 16384

Sufficient RAM enables the execution of complex tasks and reliable multitasking.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed processing, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide a solid connection to PCBs while simplifying soldering.

Analog To Digital Converters: 11-Ch 10-Bit

The capability for multiple analog to digital conversions improves integration with various sensor types.

Nominal Supply Voltage: 5 V

A nominal voltage of 5V is standard in many applications, making it easy to integrate with existing systems.

PWM Channels: YES

PWM channels enable precise control of motors and lights, enhancing versatility.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3)

Diverse connectivity options allow for integration into complex systems and facilitate communication between multiple devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the code, enhancing flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density connections, suitable for modern PCB designs.

Speed: 48 rpm

Indicates controlled motion capabilities for applications such as robotics and automation.

On Chip Program ROM Width: 8

An 8-bit ROM width allows efficient programming of smaller code, optimizing performance.

No. of I/O Lines: 38

A higher number of I/O lines expand the potential applications, allowing multiple peripherals to be connected.

Technical Specifications

Microcontrollers STR752FR0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR752FR0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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