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STR731FV0T6

STMicroelectronics

STR731FV0T6 by STMicroelectronics

STR731FV0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, supports various connectivity options like CAN and UART, making it ideal for industrial applications. With integrated ADC and DMA channels, it enhances performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,197 parts In-Stock

1+ parts

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7,197

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Anansix

USA . 1,767 parts In-Stock

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1,767

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Digiode

USA . 1,164 parts In-Stock

1+ parts

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1,164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$17.230

100+ parts

-

1k+ parts

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1,054

$17.230

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Microchip USA

USA . 282 parts In-Stock

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$19.902

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282

$19.902

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IDEA Electronic Components Group

UK . 1,575 parts In-Stock

1+ parts

$20.952

100+ parts

-

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$18.857

10k+ parts

-

1,575

$20.952

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$18.857

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MKK Technologies

India . 1,251 parts In-Stock

1+ parts

$39.399

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1,251

$39.399

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DigiPath Technology Company

USA . 1,251 parts In-Stock

1+ parts

$39.399

100+ parts

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1,251

$39.399

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Corphita

USA . 4,906 parts In-Stock

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4,906

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Parana Technologies

USA . 2,055 parts In-Stock

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$25.051

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2,055

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$25.051

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Overview

Unlock the potential of your next project with the STR731FV0T6 microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this ARM7-based powerhouse transforms innovative ideas into reality. With a robust set of peripherals and dual connectivity options, it excels in industrial applications, ensuring seamless performance even in harsh environments. Elevate your designs with unmatched efficiency and let your creativity soar!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material enhances the microcontroller's reliability in various applications.

Surface Mount: YES

Allows for a compact design, facilitating easier integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

Provides flexibility for power supply options, making it suitable for a wide range of embedded applications.

Package Shape: SQUARE

Offers efficient space utilization on printed circuit boards, enhancing layout designs.

Bit Size: 32

Supports high-performance processing, enabling more complex operations and applications.

Power Supplies (V): 5

Standard voltage level simplifies integration with common power supplies.

No. of Terminals: 100

Provides ample connectivity options for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates high-density mounting and minimizes the overall footprint of the electronic assembly.

Minimum Supply Voltage: 4.5 V

Ensures optimal performance and stability under varying operational conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperature tolerance is essential.

CPU Family: ARM7

Known for its efficiency and performance, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme environments, adding to the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures excellent corrosion resistance and improves electrical connectivity.

ADC Channels: YES

Facilitates analog signal processing, making it suitable for sensing applications.

DMA Channels: YES

Enhances data transfer efficiency, freeing the CPU to handle other tasks.

Terminal Position: QUAD

Facilitates easier routing on PCBs, optimizing layout efficiency.

ROM Words: 65536

Provides a sufficient memory space for complex firmware and application storage.

Maximum Seated Height: 1.6 mm

Suitable for low-profile designs, making it ideal for compact devices.

Width: 14 mm

A compact size that allows easy integration into various applications.

Peripherals: DMA(4), POR, RTC, TIMER(16), WDT

Rich set of peripherals allows for versatile applications in process control and automation.

Maximum Clock Frequency: 8 MHz

Provides adequate processing speed for many embedded applications while maintaining power efficiency.

Peak Reflow Temperature °C: 260

Compatible with standard soldering processes, ensuring ease of manufacturing.

Length: 14 mm

Compact dimensions make it suitable for space-constrained projects.

Temperature Grade: INDUSTRIAL

Designed for rigorous industrial applications, ensuring durability and reliability over time.

Peripheral IC Type: MICROCONTROLLER, RISC

Combines the efficiency of RISC architecture with versatile microcontroller applications.

RAM Bytes: 16384

Sufficient memory for intermediate data processing, enhancing performance for applications.

Technology: CMOS

Offers low power consumption and high speed, making it suitable for battery-operated devices.

Terminal Form: GULL WING

A common terminal form that eases soldering and improves electrical connection reliability.

Analog To Digital Converters: 12-Ch 10-Bit

Enables conversion of analog signals to digital, expanding application capabilities in sensing.

Nominal Supply Voltage: 5 V

Allows for compatibility with standard voltage levels in most systems.

PWM Channels: YES

Allows for motor control and dimming applications, adding versatility to design options.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Diverse connectivity options make it flexible for various communication requirements.

ROM Programmability: FLASH

Supports easy firmware updates and modifications, enhancing lifespan and flexibility.

Terminal Pitch: 0.5 mm

Enables compact designs with fine-pitch layouts, suitable for advanced electronic designs.

Moisture Sensitivity Level (MSL): 3

Provides guidelines for handling and storage, ensuring product longevity.

Speed: 36 rpm

Sufficient for control purposes in many applications, enhancing product functionality.

On Chip Program ROM Width: 8

Compatible with a variety of programming requirements, offering design flexibility.

No. of I/O Lines: 72

Ample GPIO lines enable extensive interfacing with other components and peripherals.

Technical Specifications

Microcontrollers STR731FV0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR731FV0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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