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STR730FZ2T6

STMicroelectronics

STR730FZ2T6 by STMicroelectronics

STR730FZ2T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 144 terminals, supports CAN, I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and DMA support, it's perfect for complex control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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RLX Solution Inc.

Canada . 9,000 parts In-Stock

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9,000

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Chip Stock

USA . 7,750 parts In-Stock

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7,750

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Vyrian

USA . 3,826 parts In-Stock

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3,826

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Anansix

USA . 2,285 parts In-Stock

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2,285

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Digiode

USA . 433 parts In-Stock

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433

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Distributors (Availability)

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AZTECH Wire

Italy . 1,162 parts In-Stock

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$9.200

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1,162

$9.200

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Advanced Electronics

New Zealand . 77 parts In-Stock

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$18.564

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$16.893

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$15.222

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77

$18.564

$16.893

$15.222

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IDEA Electronic Components Group

UK . 909 parts In-Stock

1+ parts

$26.874

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-

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$24.187

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909

$26.874

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$24.187

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MKK Technologies

India . 2,100 parts In-Stock

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$50.535

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2,100

$50.535

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DigiPath Technology Company

USA . 2,100 parts In-Stock

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$50.535

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2,100

$50.535

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QUARKTWIN TECHNOLOGY LTD

USA . 21,968 parts In-Stock

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21,968

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Perfect Parts

USA . 9,819 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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GreenTree Electronics

Israel . 5,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,583 parts In-Stock

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4,583

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Authorized Procurement Solutions

USA . 2,400 parts In-Stock

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2,400

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RC Electronics

USA . 1,540 parts In-Stock

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Parana Technologies

USA . 914 parts In-Stock

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$32.132

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914

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$32.132

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Metaverse IC Inc.

Canada . 820 parts In-Stock

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820

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Corphita

USA . 301 parts In-Stock

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301

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Unlock the power of innovation with the STR730FZ2T6 microcontroller from STMicroelectronics. Renowned for its reliability and cutting-edge technology, STMicroelectronics ensures top-tier quality in every product. This versatile 32-bit ARM7 microcontroller is perfect for a wide range of applications, delivering exceptional performance in industrial environments. Experience seamless connectivity and enhanced processing capabilities that elevate your projects, all while benefiting from ST's industry-leading support. Embrace excellence and drive your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body offers durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact assembly, enabling high-density circuit designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various power supply designs.

Package Shape: SQUARE

Square package shape allows for efficient PCB layout and better space utilization.

Bit Size: 32

A 32-bit architecture increases processing capability and efficiency, allowing for complex computations.

Power Supplies (V): 5

Operating at 5 V simplifies integration with commonly used digital systems.

No. of Terminals: 144

With 144 terminals, this microcontroller supports extensive connectivity options for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flat pack design enhances compatibility with modern high-density PCBs.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum of 4.5 V ensures functionality in a range of voltage conditions.

Maximum Operating Temperature: 85 °C

Operating at high temperatures up to 85 °C makes this microcontroller suitable for industrial environments.

CPU Family: ARM7

The ARM7 family offers robust performance with low power consumption, ideal for mobile and embedded applications.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C ensures reliability in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finishing promotes good solderability, enhancing assembly quality.

ADC Channels: YES

Integrated ADC channels enable effective sensor interfacing, vital for data acquisition systems.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, improving performance and responsiveness.

Terminal Position: QUAD

Quad terminal positioning allows for versatile mounting options on circuits.

ROM Words: 262144

A large ROM capacity supports complex applications, allowing for extensive code storage.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for compact designs, enabling thinner devices.

Width: 20 mm

A standard width of 20 mm is advantageous for PCB layout consistency and ease of manufacture.

Peripherals: DMA(4), POR, RTC, TIMER(20), WDT

Rich peripheral set enhances functionality, supporting various applications from timers to real-time clocks.

Maximum Clock Frequency: 8 MHz

With a maximum clock frequency of 8 MHz, it balances performance with power efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time of 40 seconds ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures the microcontroller withstands modern assembly conditions.

Length: 20 mm

Standard length of 20 mm simplifies integration within a variety of cases and housings.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes instruction processing speed, improving overall system performance.

RAM Bytes: 16384

Adequate RAM size supports complex applications and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, increasing battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical and electrical connections, reducing the risk of damage.

Analog To Digital Convertors: 16-Ch 10-Bit

A 16-channel 10-bit ADC allows for comprehensive data collection from a variety of sensors, enhancing versatility.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with many popular devices, ensuring easy integration.

PWM Channels: YES

PWM channels are essential for motor control and other applications requiring variable signal generation.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Multiple connectivity options enable integration with various communication protocols for flexible design.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, extending the product's lifecycle.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm maximizes space efficiency on PCBs, supporting compact designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding handling and storage practices.

Speed: 36 rpm

A speed of 36 rpm facilitates applications requiring slow-moving mechanisms, such as robotics.

On Chip Program ROM Width: 8

An 8-bit ROM width optimizes compatibility with various coding practices and memory management.

No. of I/O Lines: 112

A high number of I/O lines allows for extensive interfacing capabilities, accommodating growth in complex applications.

Technical Specifications

Microcontrollers STR730FZ2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(20), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR730FZ2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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