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STR715FR0T1

STMicroelectronics

STR715FR0T1 by STMicroelectronics

STR715FR0T1 by STMicroelectronics is a 32-bit ARM7 microcontroller designed for low-power applications, featuring a max supply voltage of 3.6V and 64 terminals. It supports I2C, SPI, and UART connectivity with integrated ADC channels. Ideal for embedded systems, it operates efficiently in commercial temperature ranges (0-70 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,372 parts In-Stock

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3,372

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Vyrian

USA . 2,353 parts In-Stock

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2,353

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Anansix

USA . 2,014 parts In-Stock

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2,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 125 parts In-Stock

1+ parts

$10.965

100+ parts

-

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125

$10.965

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$19.700

100+ parts

-

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254

$19.700

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Ampacity Inc.

Singapore . 1,527 parts In-Stock

1+ parts

$31.000

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-

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1,527

$31.000

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IDEA Electronic Components Group

UK . 1,006 parts In-Stock

1+ parts

$52.467

100+ parts

-

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$47.220

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1,006

$52.467

-

$47.220

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MKK Technologies

India . 1,970 parts In-Stock

1+ parts

$98.660

100+ parts

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1,970

$98.660

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DigiPath Technology Company

USA . 1,970 parts In-Stock

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$98.660

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1,970

$98.660

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QUARKTWIN TECHNOLOGY LTD

USA . 27,499 parts In-Stock

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27,499

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Kepictronics

USA . 7,600 parts In-Stock

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7,600

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 2,880 parts In-Stock

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2,880

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Parana Technologies

USA . 2,361 parts In-Stock

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$62.732

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2,361

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$62.732

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RC Electronics

USA . 1,708 parts In-Stock

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1,708

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Corphita

USA . 1,524 parts In-Stock

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1,524

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Metaverse IC Inc.

Canada . 318 parts In-Stock

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318

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Overview

Unlock the potential of your next project with the STR715FR0T1 microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics offers innovative solutions that cater to a wide range of applications—from industrial automation to smart home devices. With its efficient power management and versatile connectivity options, the STR715FR0T1 enhances performance while reducing energy consumption, empowering you to create cutting-edge designs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures good protection against environmental factors, enhancing longevity.

Surface Mount: YES

Surface mount technology allows for compact design, enabling high-density circuit board layouts.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage contributes to reduced power consumption, making it energy efficient.

Package Shape: SQUARE

Square package shape provides uniform compatibility with various circuit designs.

Bit Size: 32

32-bit architecture allows for more powerful processing capabilities and better performance in data handling.

Power Supplies (V): 3.3

Optimized for 3.3V supply, a common voltage in many digital systems, facilitating easier integration.

No. of Terminals: 64

A higher number of terminals allows for more I/O options, providing flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile design aids in compact assemblies and efficient space utilization on PCBs.

Minimum Supply Voltage: 3 V

A low minimum supply voltage enables operation in battery-powered applications, extending device lifetime.

Maximum Operating Temperature: 70 °C

High operating temperature tolerance makes it suitable for applications in moderate to challenging environments.

CPU Family: ARM7

ARM7 core offers high performance and is widely supported, ensuring a lot of resources and community support.

Minimum Operating Temperature: 0 °C

This range allows the microcontroller to operate in diverse weather conditions, enhancing device reliability.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and ensures better electrical conductivity during connections.

ADC Channels: YES

Inclusion of ADC channels allows for direct analog input, enhancing the controller's versatility for various applications.

Terminal Position: QUAD

Quad terminal positioning aids in improved thermal and electrical performance in packed layouts.

ROM Words: 16384

A substantial ROM allows for adequate storage of programs and data, enhancing functionality.

Maximum Seated Height: 1.6 mm

Low seated height promotes efficient stacking and compact design in space-constrained applications.

Width: 10 mm

Narrow width supports integration into miniaturized electronic designs without compromising performance.

Data EEPROM Size: 16K

Sufficient EEPROM size for storing configuration and settings, improving user experience and functionality.

Peripherals: RTC, TIMER(5)

Integrated peripherals like RTC and multiple timers enhance real-time capabilities, making this microcontroller versatile for time-sensitive applications.

Maximum Clock Frequency: 16.5 MHz

A high clock frequency provides faster execution of instructions and better overall performance in processing tasks.

Length: 10 mm

Compact length enhances compatibility with various designs while maximizing board space.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes it appropriate for everyday consumer applications, ensuring consistent performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution, leading to high performance in embedded applications.

RAM Bytes: 16384

Ample RAM size supports more complex applications and multitasking substantially enhancing functionality.

Technology: CMOS

CMOS technology ensures low power consumption and high density, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads provide a stable connection and ease of soldering, ensuring reliable device performance.

Analog To Digital Converters: 4-Ch 12-Bit

Multiple high-resolution ADC channels facilitate precise conversion of analog signals, vital for accurate digital data processing.

Maximum Supply Current: 100 mA

The moderate maximum supply current supports efficient power management in various applications.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage allows for easy compatibility with other components in the modern electronics ecosystem.

PWM Channels: YES

Presence of PWM channels allows for advanced control of motors and lights, expanding application capabilities.

Connectivity: I2C(2), SMARTCARD, SPI(2), UART(4)

Rich set of connectivity options enables easy integration with various sensors and peripherals, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and customization, making it adaptable to different applications.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable higher-density connections, critical for modern compact designs.

Speed: 66 rpm

A specified speed rating indicates capability for varied applications requiring rotational sensors or control.

On Chip Program ROM Width: 32

32-bit ROM width enhances instruction set capacity, allowing for more complex programming capabilities.

No. of I/O Lines: 32

A high number of I/O lines offers flexibility and the ability to connect multiple peripherals and sensors simultaneously.

Technical Specifications

Microcontrollers STR715FR0T1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C(2), SMARTCARD, SPI(2), UART(4)

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR715FR0T1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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