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STR711FR2T6

STMicroelectronics

STR711FR2T6 by STMicroelectronics

STR711FR2T6 from STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 3.0-3.6V, features 64 terminals, and includes peripherals like RTC and timers. With a max temp of 85 °C and 4 ADC channels, it ensures reliable performance in demanding environments.

Median Price

$16.800

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 619 parts In-Stock

1+ parts

$16.800

100+ parts

$14.861

1k+ parts

$13.776

10k+ parts

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619

$16.800

$14.861

$13.776

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Sensible Micro Corp

USA . 9,650 parts In-Stock

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Chip Stock

USA . 8,500 parts In-Stock

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8,500

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Vyrian

USA . 7,002 parts In-Stock

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7,002

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Digiode

USA . 3,659 parts In-Stock

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3,659

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Anansix

USA . 247 parts In-Stock

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247

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J2 Sourcing AB

Sweden . 242 parts In-Stock

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242

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Cyclops Electronics Ltd

UK . 41 parts In-Stock

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41

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 82 parts In-Stock

1+ parts

$10.850

100+ parts

-

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82

$10.850

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$24.706

100+ parts

-

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$22.235

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1,703

$24.706

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$22.235

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$41.725

100+ parts

$37.970

1k+ parts

$34.214

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3,000

$41.725

$37.970

$34.214

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MKK Technologies

India . 1,953 parts In-Stock

1+ parts

$46.457

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1,953

$46.457

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DigiPath Technology Company

USA . 1,953 parts In-Stock

1+ parts

$46.457

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1,953

$46.457

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Microchip USA

USA . 160 parts In-Stock

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$73.250

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160

$73.250

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Perfect Parts

USA . 22,648 parts In-Stock

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22,648

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Futuretech Components

Singapore . 9,000 parts In-Stock

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9,000

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Assy Fe

Spain . 7,997 parts In-Stock

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7,997

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,946 parts In-Stock

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$29.539

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1,946

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$29.539

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RC Electronics

USA . 1,560 parts In-Stock

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1,560

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Corphita

USA . 322 parts In-Stock

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322

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iodParts Technologies Inc.

India . 2 parts In-Stock

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2

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Overview

Elevate your projects with the STR711FR2T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and performance, this ARM7-based powerhouse excels in industrial applications, offering low power consumption and robust connectivity options. Experience seamless integration in your designs while benefiting from unmatched support and quality assurance that STMicroelectronics is renowned for. Unlock limitless potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources and prevents over-voltage damage.

Package Shape: SQUARE

The square package shape optimizes space on PCBs and enhances layout flexibility.

Bit Size: 32

A 32-bit architecture allows for more complex computations and better performance in processing tasks.

Power Supplies (V): 3.3

The nominal power supply of 3.3 V is widely used, ensuring ease of integration into existing systems.

No. of Terminals: 64

With 64 terminals, this microcontroller supports many peripherals and I/O connections, ideal for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style allows for low-profile designs, suitable for compact or portable electronic devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in a variety of low-power environments.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes it suitable for industrial applications with higher thermal demands.

CPU Family: ARM7

The ARM7 CPU family is known for its efficiency and power-saving capabilities, important for battery-operated devices.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C ensures reliability in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and reduces oxidation, resulting in longer device lifespans.

ADC Channels: YES

The inclusion of ADC channels enables digital systems to interact with analog sensors, widening application possibilities.

Terminal Position: QUAD

Quad terminal position allows for a more versatile mounting option for various designs.

ROM Words: 32768

With 32,768 ROM words, there's ample storage for application code and data.

Maximum Seated Height: 1.6 mm

A low maximum seated height allows for slim designs, contributing to overall system miniaturization.

Width: 10 mm

A compact width of 10 mm makes it suitable for space-constrained applications.

Data EEPROM Size: 16K

16K of EEPROM is sufficient for non-volatile data storage, enhancing memory management capabilities.

Peripherals: RTC, TIMER(5)

Inbuilt real-time clock and multiple timers cater to time-critical applications, improving functionality.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz enables efficient processing speeds for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Compliance with peak reflow temperatures ensures better manufacturing tolerances.

Peak Reflow Temperature °C: 260

Operating at high peak reflow temperatures allows for the use of advanced soldering techniques in assembly.

Length: 10 mm

The compact length of 10 mm allows for efficient use of PCB real estate in designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability in significant temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller offers lower power consumption and higher performance, ideal for embedded applications.

RAM Bytes: 65536

64K of RAM provides ample memory for temporary data processing in various applications.

Technology: CMOS

CMOS technology provides low static power consumption and high-speed performance characteristics.

Terminal Form: GULL WING

Gull wing terminals are standard for easy soldering and maintenance on PCBs.

Analog To Digital Converters: 4-Ch 12-Bit

Having four 12-bit ADC channels allows for high-resolution signal conversion, essential in accurate sensing applications.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows for power-efficient designs while providing sufficient power for performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V is conducive for low-power applications, ensuring energy efficiency.

PWM Channels: YES

Support for PWM channels enables sophisticated control of motors and other actuators, enhancing operational flexibility.

Connectivity: I2C(2), SMARTCARD, SPI(2), UART(4), USB

Robust connectivity options make this microcontroller versatile in communication with various devices and networks.

ROM Programmability: FLASH

Flash ROM allows for easy updates and modifications to code, increasing the product's lifespan and adaptability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense layouts while maintaining manufacturability.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that proper handling and storage are essential, contributing to durability in the production process.

Speed: 66 rpm

Speed rating of 66 rpm ensures that the microcontroller can handle timing-sensitive tasks efficiently.

On Chip Program ROM Width: 32

A 32-bit program ROM width enhances data handling capacity, allowing for a richer set of instructions and operations.

No. of I/O Lines: 30

Thirty I/O lines provide significant flexibility in interfacing with external components, essential for diverse applications.

Technical Specifications

Microcontrollers STR711FR2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C(2), SMARTCARD, SPI(2), UART(4), USB

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR711FR2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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