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STP9NM60N

STMicroelectronics

STP9NM60N by STMicroelectronics

STP9NM60N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 26A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$2.060

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 18 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

18

$1.780

-

-

-

Element14

Singapore . 18 parts In-Stock

1+ parts

$2.060

100+ parts

$1.750

1k+ parts

$1.510

10k+ parts

$1.500

18

$2.060

$1.750

$1.510

$1.500

Farnell

UK . 18 parts In-Stock

1+ parts

$2.830

100+ parts

$1.290

1k+ parts

$0.963

10k+ parts

$0.896

18

$2.830

$1.290

$0.963

$0.896

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.385

10k+ parts

$2.309

2,000

-

-

$2.385

$2.309

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.550

10k+ parts

-

2,000

-

-

$0.550

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,431 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

-

3,431

$1.368

-

-

-

Vyrian

USA . 5,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,204

-

-

-

-

Anansix

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

-

-

-

-

ComSIT Distribution GmbH

Germany . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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950

-

-

-

-

ComSIT USA

USA . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

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MISTER SPROCKETS

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

$0.352

10k+ parts

-

310

$0.391

-

$0.352

-

MKK Technologies

India . 1,648 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

-

1,648

$0.735

-

-

-

DigiPath Technology Company

USA . 1,648 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

-

1,648

$0.735

-

-

-

Corphita

USA . 2,537 parts In-Stock

1+ parts

$1.296

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

$1.296

-

-

-

Continental Prestige Electronics

USA . 12 parts In-Stock

1+ parts

$1.380

100+ parts

$0.992

1k+ parts

$0.824

10k+ parts

-

12

$1.380

$0.992

$0.824

-

Microchip USA

USA . 3,209 parts In-Stock

1+ parts

$17.550

100+ parts

-

1k+ parts

-

10k+ parts

-

3,209

$17.550

-

-

-

Perfect Parts

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,540

-

-

-

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A-Z Elektronik GmbH

Germany . 5,789 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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5,789

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

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Alle Elektronik GmbH

Germany . 3,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,586

-

-

-

-

Parana Technologies

USA . 1,315 parts In-Stock

1+ parts

-

100+ parts

$0.468

1k+ parts

-

10k+ parts

-

1,315

-

$0.468

-

-

Overview

Elevate your designs with the STP9NM60N from STMicroelectronics—where innovation meets reliability! This powerful N-channel MOSFET is engineered for superior switching performance, making it ideal for demanding applications in automotive, industrial, and consumer electronics. With STMicroelectronics' commitment to quality, you gain access to cutting-edge technology that enhances efficiency and reduces energy loss, ensuring your projects excel while maximizing value. Experience excellence with ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

Being an N-channel FET allows for efficient switching characteristics, making it ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode enhances protection in circuits, improving overall reliability.

Transistor Application: SWITCHING

Designed for switching applications, it offers high efficiency and fast response times for effective output control.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage makes it suitable for high-voltage applications, providing added safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for compact design and easy integration into various circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure mounting and stable electrical connections, which is beneficial for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to lower off-state leakage current, enhancing the efficiency of power applications.

Maximum Pulsed Drain Current (IDM): 26 A

A high pulsed drain current rating allows the transistor to handle brief surges in current, making it suitable for robust applications.

Avalanche Energy Rating (EAS): 115 mJ

An avalanche energy rating of 115 mJ indicates its capability to withstand energy spikes, thus improving circuit reliability.

Maximum Drain Current (Abs) (ID): 9 A

The maximum drain current allows it to handle substantial loads, versatile for various power applications.

No. of Terminals: 3

With a three-terminal configuration, it provides straightforward integration into existing circuits, promoting ease of use.

Maximum Power Dissipation (Abs): 100 W

The high power dissipation capacity allows it to effectively manage heat, enhancing performance in high-power scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides a secure connection and ease of assembly, suited for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology enhances the performance and efficiency of the FET, promoting better overall circuit behavior.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for reliable performance in demanding environments, ensuring longevity.

Transistor Element Material: SILICON

Silicon as the element material offers excellent thermal stability and performance, widely regarded in power applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability, ensuring that the FET can be easily incorporated into different assemblies.

Maximum Drain Current (ID): 6.5 A

Supporting a maximum drain current of 6.5 A ensures reliable operation in moderate power applications.

Maximum Drain-Source On Resistance: 0.745 ohm

A low on-resistance reduces power losses and enhances efficiency, making this FET suitable for power management.

Terminal Position: SINGLE

A single terminal position simplifies circuit design, making integration straightforward and efficient.

Technical Specifications

Power Field Effect Transistors (FET) STP9NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

115 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.745 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP9NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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