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STP9N80K5

STMicroelectronics

STP9N80K5 by STMicroelectronics

STP9N80K5 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain-source voltage of 800V and a pulsed drain current of 28A. It operates in enhancement mode with a power dissipation of up to 110W. This versatile transistor is suitable for high-temperature environments, ranging from -55 °C to 150 °C.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$2.550

100+ parts

$1.680

1k+ parts

$1.420

10k+ parts

-

50

$2.550

$1.680

$1.420

-

Mouser Electronics

USA . 556 parts In-Stock

1+ parts

$2.660

100+ parts

$1.760

1k+ parts

$1.260

10k+ parts

$1.230

556

$2.660

$1.760

$1.260

$1.230

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.524

1k+ parts

$1.090

10k+ parts

$1.041

50

-

$1.524

$1.090

$1.041

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,794 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

-

10k+ parts

-

4,794

$0.884

-

-

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Vyrian

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

-

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-

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6,050

-

-

-

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Anansix

USA . 1,510 parts In-Stock

1+ parts

-

100+ parts

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1,510

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

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1k+ parts

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,383 parts In-Stock

1+ parts

$0.838

100+ parts

-

1k+ parts

-

10k+ parts

-

1,383

$0.838

-

-

-

IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$1.298

100+ parts

-

1k+ parts

$1.168

10k+ parts

-

2,327

$1.298

-

$1.168

-

MKK Technologies

India . 1,448 parts In-Stock

1+ parts

$2.441

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

$2.441

-

-

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DigiPath Technology Company

USA . 1,448 parts In-Stock

1+ parts

$2.441

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

$2.441

-

-

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Microchip USA

USA . 7,629 parts In-Stock

1+ parts

$9.233

100+ parts

-

1k+ parts

-

10k+ parts

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7,629

$9.233

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-

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A-Z Elektronik GmbH

Germany . 7,446 parts In-Stock

1+ parts

-

100+ parts

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7,446

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-

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Alle Elektronik GmbH

Germany . 4,852 parts In-Stock

1+ parts

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100+ parts

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4,852

-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Perfect Parts

USA . 1,344 parts In-Stock

1+ parts

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1,344

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Parana Technologies

USA . 388 parts In-Stock

1+ parts

-

100+ parts

$1.552

1k+ parts

-

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388

-

$1.552

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Overview

Unlock superior performance with the STP9N80K5 from STMicroelectronics, a powerhouse in the realm of N-channel power FETs. Engineered for exceptional reliability and efficiency, this transistor excels in high-voltage switching applications, making it ideal for industrial automation, power supplies, and more. With STMicroelectronics' renowned commitment to quality, you can trust the STP9N80K5 to deliver outstanding value and durability, ensuring your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection against environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics, making them suitable for high-speed and high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit design flexibility and simplifies protection against reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient operation in various electronic circuits.

Minimum DS Breakdown Voltage: 800 V

This high breakdown voltage allows the FET to be used in high-voltage applications, ensuring safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape aids in easy integration into circuit designs, optimizing board space and layout.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure a robust mechanical connection, enhancing the stability of the FET in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the drain current, enhancing efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 28 A

This high pulsed drain current capacity enables the FET to handle significant current loads during transient conditions.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating indicates tolerance to voltage spikes, ensuring protection against transient events.

No. of Terminals: 3

The 3-terminal design simplifies integration and reduces complexity in circuit layouts.

Maximum Power Dissipation (Abs): 110 W

This substantial power dissipation capability allows for use in high-performance applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides secure attachment and aids in effective heat dissipation for improved thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high switching speeds, making it ideal for modern electronic circuits.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures increases reliability and allows usage in demanding environments.

Transistor Element Material: SILICON

Silicon is a proven and widely used semiconductor material that offers excellent performance and reliability.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures functionality in extreme environments, making it suitable for outdoor and industrial applications.

Maximum Drain Current (ID): 7 A

The capability to handle 7 A of maximum drain current indicates suitability for various electronic devices that require efficient power management.

Maximum Drain-Source On Resistance: 0.9 ohm

Low on-resistance reduces power losses during operation, enhancing energy efficiency in various applications.

Terminal Position: SINGLE

The single terminal position contributes to simple and straightforward integration into circuit designs.

Case Connection: DRAIN

Direct drain connection allows for effective heat transfer and efficient operation of the FET in power circuits.

Maximum Feedback Capacitance (Crss): 0.65 pF

Low feedback capacitance supports high-frequency applications, ensuring improved performance in communication and signal processing circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP9N80K5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.65 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP9N80K5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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