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STP9NB50FP

STMicroelectronics

STP9NB50FP by STMicroelectronics

STP9NB50FP by STMicroelectronics is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 34.4A Max Pulsed Drain Current and 0.85 ohm Max Drain-Source On Resistance, operating in ENHANCEMENT MODE up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,019 parts In-Stock

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Anansix

USA . 2,752 parts In-Stock

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2,752

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Digiode

USA . 2,057 parts In-Stock

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ABC Electronics Ltd.

UK . 90 parts In-Stock

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90

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

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$1.591

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$1.432

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1,872

$1.591

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$1.432

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MKK Technologies

India . 327 parts In-Stock

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$2.991

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327

$2.991

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DigiPath Technology Company

USA . 327 parts In-Stock

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$2.991

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327

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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Kepictronics

USA . 5,036 parts In-Stock

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Corphita

USA . 3,124 parts In-Stock

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Parana Technologies

USA . 1,461 parts In-Stock

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$1.902

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Looking to enhance the performance of your switching applications? Look no further than the STP9NB50FP by STMicroelectronics. With a high DS breakdown voltage of 500V and a maximum pulsed drain current of 34.4A, this N-Channel Power FET offers reliability and efficiency like no other. Whether you're in the automotive, industrial, or consumer electronics industry, this transistor is designed to meet your power needs with its single configuration and built-in diode. Trust in STMicroelectronics' superior quality and innovation to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in modern electronic devices due to their high performance and efficiency, making this product a good choice for applications requiring these features.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making the product more convenient to use in various applications.

Transistor Application: SWITCHING

This product is specifically designed for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltages, making it suitable for applications where voltage spikes or surges may occur.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and placement on circuit boards, enhancing usability and installation efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection, making the FET more durable and less prone to disconnection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low on-state resistance, making them ideal for high-frequency applications.

Maximum Pulsed Drain Current (IDM): 34.4 A

The high pulsed drain current rating allows the FET to handle sudden spikes in current, making it suitable for power management applications.

Avalanche Energy Rating (EAS): 520 mJ

The high avalanche energy rating indicates that the FET can safely handle energy spikes or transients, improving the overall reliability of the product.

Maximum Drain Current (Abs) (ID): 4.9 A

The high drain current rating ensures that the FET can handle continuous current flow without overheating or failing prematurely.

No. of Terminals: 3

Having 3 terminals allows for easy integration into existing circuits, providing flexibility in design and application.

Maximum Power Dissipation (Abs): 40 W

The high power dissipation rating indicates that the FET can handle high power loads without overheating, ensuring reliable performance under heavy use.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and heat dissipation, improving the overall performance and longevity of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this product suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures, making it suitable for industrial or automotive applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this FET a durable and long-lasting choice for various applications.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides corrosion resistance and ensures good electrical contact, improving the overall reliability of the product.

Maximum Drain-Source On Resistance: 0.85 ohm

With low on-resistance, this FET can handle high current loads with minimal voltage drop, ensuring efficient power management in various applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures proper alignment, reducing the risk of errors or malfunctions.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference, making this FET suitable for sensitive electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STP9NB50FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

520 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

4.9 A

Maximum Drain Current (ID):

4.9 A

Maximum Drain-Source On Resistance:

.85 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP9NB50FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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