Loading...

STP95N3LLH6

STMicroelectronics

STP95N3LLH6 by STMicroelectronics

STP95N3LLH6 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.0075 Ω).

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,005

-

-

-

-

Bristol Electronics

USA . 3,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,750

-

-

-

-

Dan-Mar Components

USA . 3,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,750

-

-

-

-

Anansix

USA . 1,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,880

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Digiode

USA . 201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

201

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$1.081

100+ parts

-

1k+ parts

$0.973

10k+ parts

-

1,729

$1.081

-

$0.973

-

Component Stockers USA

USA . 4,387 parts In-Stock

1+ parts

$1.310

100+ parts

$1.250

1k+ parts

$1.210

10k+ parts

-

4,387

$1.310

$1.250

$1.210

-

MKK Technologies

India . 1,356 parts In-Stock

1+ parts

$2.033

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

$2.033

-

-

-

DigiPath Technology Company

USA . 1,356 parts In-Stock

1+ parts

$2.033

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

$2.033

-

-

-

AZTECH Wire

Italy . 1,118 parts In-Stock

1+ parts

$15.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,118

$15.890

-

-

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,750

-

-

-

-

Perfect Parts

USA . 5,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,359

-

-

-

-

Alle Elektronik GmbH

Germany . 4,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,947

-

-

-

-

Parana Technologies

USA . 1,930 parts In-Stock

1+ parts

-

100+ parts

$1.292

1k+ parts

-

10k+ parts

-

1,930

-

$1.292

-

-

Assy Fe

Spain . 1,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Corphita

USA . 756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

756

-

-

-

-

Overview

Unlock unparalleled performance with the STP95N3LLH6 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, delivering reliability and efficiency that surpasses industry standards. With its robust design and superior thermal management, it’s perfect for demanding environments. Experience enhanced power handling and minimize energy loss, ensuring your projects thrive while enjoying the trusted quality of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental stress, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and offer better efficiency, making them a preferred choice for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for improved protection against reverse current and simplifies circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures rapid response times and low power loss during operation.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V makes this FET suitable for applications with high voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and better space utilization in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections and are ideal for applications requiring high mechanical strength.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low on-resistance and high efficiency, crucial for modern power applications.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current rating enables this FET to handle demanding peak loads effectively.

Avalanche Energy Rating (EAS): 150 mJ

The ability to withstand avalanche energy enhances reliability in transient conditions, making it suitable for robust applications.

Maximum Drain Current (Abs) (ID): 80 A

An absolute maximum drain current of 80A supports powerful operations in heavy-duty applications.

No. of Terminals: 3

With 3 terminals, this FET simplifies circuit integration and facilitates efficient design.

Maximum Power Dissipation (Abs): 70 W

A power dissipation capability of 70W allows this FET to manage heat effectively, extending its operational lifespan.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers easy installation and stable mounting in various applications, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high input impedance and low gate drive power, ideal for efficient circuit designs.

Maximum Operating Temperature: 175 °C

A high operating temperature tolerance of 175 °C makes this FET suitable for applications in extreme conditions.

Transistor Element Material: SILICON

Silicon as the transistor material allows for excellent electrical characteristics, ensuring reliable performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and resistance to oxidation, enhancing long-term reliability.

Maximum Drain Current (ID): 80 A

With a maximum drain current of 80A, this FET can handle significant load demands in various applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

A low on-resistance of 0.0075 ohm ensures minimal energy loss during operation, boosting overall efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout process, making integration straightforward.

Case Connection: DRAIN

The drain connection type streamlines circuit design and ensures effective heat dissipation during high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP95N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP95N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19