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STP70N10

STMicroelectronics

STP70N10 by STMicroelectronics

STP70N10 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 65 A, a breakdown voltage of 100 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,761 parts In-Stock

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3,761

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Vyrian

USA . 3,084 parts In-Stock

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3,084

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Anansix

USA . 583 parts In-Stock

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583

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Prism Electronics

USA . 31 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$0.897

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$0.807

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791

$0.897

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$0.807

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MKK Technologies

India . 656 parts In-Stock

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$1.687

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$1.687

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DigiPath Technology Company

USA . 656 parts In-Stock

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$1.687

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656

$1.687

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Corphita

USA . 3,937 parts In-Stock

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Parana Technologies

USA . 1,921 parts In-Stock

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$1.072

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Overview

Unlock unparalleled performance with the STP70N10 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET is engineered for robust switching applications, delivering exceptional efficiency and reliability. With its compact design and impressive current capabilities, it seamlessly integrates into various systems—from industrial machinery to consumer electronics—empowering you to achieve greater productivity and superior results. Choose STMicroelectronics for unmatched quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight housing, ensuring the transistor is suitable for a variety of applications while also enhancing thermal performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient than P-channel types, allowing for higher performance and lower on-resistance, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuit design by providing inherent protection against reverse polarity.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for rapid switching speeds, enhancing efficiency in power management systems.

Minimum DS Breakdown Voltage: 100 V

A minimum breakdown voltage of 100V enables the device to handle high voltage applications, expanding its usability in various electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and positioning, improving design flexibility in circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust physical connections and make the FET suitable for prototyping and high-current applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a fully off state, reducing power consumption when the transistor is not in use, making it energy efficient.

Maximum Pulsed Drain Current (IDM): 260 A

A high pulsed drain current rating of 260A indicates the ability to handle transient currents without damage, perfect for demanding power circuit applications.

Maximum Drain Current (Abs) (ID): 65 A

The maximum drain current of 65A allows for substantial load handling, making this FET capable of reliable operation in high-power conditions.

No. of Terminals: 3

Having three terminals simplifies the connection and integration into circuits, while offering all necessary functionality for typical applications.

Maximum Power Dissipation (Abs): 150 W

150W power dissipation capability ensures that this FET can handle substantial power without overheating, improving reliability in high-load scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers easier installation and better mechanical stability, making it suitable for various applications, especially in challenging environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high efficiency and low switching losses, leading to an overall enhancement in performance for power management.

Maximum Operating Temperature: 175 °C

An operating temperature of up to 175 °C guarantees reliable performance in high-temperature environments, broadening its applicability.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides excellent electrical properties and thermal stability, contributing to the robustness of the device.

Maximum Drain Current (ID): 65 A

The ability to handle a maximum drain current of 65A allows for versatility in powering various electronic components effectively.

Maximum Drain-Source On Resistance: 0.0195 ohm

A low on-resistance of 0.0195 ohms reduces power losses during operation, improving the overall efficiency of the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and contributes to compact designs, making it a convenient choice for circuit designers.

Technical Specifications

Power Field Effect Transistors (FET) STP70N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.0195 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

260 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP70N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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