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STP75N3LLH6

STMicroelectronics

STP75N3LLH6 by STMicroelectronics

STP75N3LLH6 by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage and 75A Drain Current. Ideal for SWITCHING applications, it features a max IDM of 300A and 0.0084 ohm On Resistance. Operating in ENHANCEMENT MODE, this transistor has a power dissipation of 60W at 175 °C.

Median Price

$0.750

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,015 parts In-Stock

1+ parts

$0.517

100+ parts

-

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3,015

$0.517

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Chip1Stop

Japan . 3,015 parts In-Stock

1+ parts

$0.984

100+ parts

-

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3,015

$0.984

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DigiKey

USA . 1,906 parts In-Stock

1+ parts

$1.790

100+ parts

$0.774

1k+ parts

$0.565

10k+ parts

-

1,906

$1.790

$0.774

$0.565

-

Verical

USA . 3,015 parts In-Stock

1+ parts

-

100+ parts

$0.517

1k+ parts

-

10k+ parts

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3,015

-

$0.517

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 416 parts In-Stock

1+ parts

$0.491

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416

$0.491

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Vyrian

USA . 4,534 parts In-Stock

1+ parts

$0.517

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-

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4,534

$0.517

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Anansix

USA . 1,161 parts In-Stock

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1,161

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,587 parts In-Stock

1+ parts

$0.439

100+ parts

-

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2,587

$0.439

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Corphita

USA . 2,277 parts In-Stock

1+ parts

$0.465

100+ parts

-

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2,277

$0.465

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$1.144

100+ parts

-

1k+ parts

$1.030

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109

$1.144

-

$1.030

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MKK Technologies

India . 1,512 parts In-Stock

1+ parts

$2.152

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1,512

$2.152

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$2.152

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1,512

$2.152

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Microchip USA

USA . 359 parts In-Stock

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$9.620

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359

$9.620

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,383 parts In-Stock

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4,383

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Parana Technologies

USA . 1,904 parts In-Stock

1+ parts

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100+ parts

$1.368

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1,904

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$1.368

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Alle Elektronik GmbH

Germany . 1,576 parts In-Stock

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1,576

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Overview

Unleash the power of innovation with the STP75N3LLH6 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors (FET) like no other. Ideal for switching applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing seamless functionality and reliability. With a maximum pulsing drain current of 300 A and a minimum DS breakdown voltage of 30 V, this transistor is designed to meet your power needs with ease. Trust STMicroelectronics to elevate your projects to new heights with the STP75N3LLH6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, making it suitable for a variety of operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have faster switching speeds compared to P-channel FETs, making them efficient for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of safety to the device.

Transistor Application: SWITCHING

This FET is specifically designed for switching applications, ensuring reliable and efficient performance in controlling power flow.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels without risking damage to the internal components.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off until a gate voltage is applied, offering control over the power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 300 A

The high pulsed drain current capability makes this FET suitable for applications that require short bursts of high power.

Maximum Drain Current (Abs) (ID): 75 A

The high maximum drain current rating allows for efficient power handling, making it suitable for medium to high-power applications.

Maximum Power Dissipation (Abs): 60 W

The high power dissipation rating ensures that the FET can handle power efficiently without overheating.

Maximum Drain-Source On Resistance: 0.0084 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, making it energy-efficient.

Technical Specifications

Power Field Effect Transistors (FET) STP75N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP75N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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